동력기계공학회지 (Journal of Power System Engineering)

  • 제18권3호
  • /
  • Pages.87-92
  • /
  • 2014
  • /
  • 2713-8429(pISSN)
  • /
  • 2713-8437(eISSN)
한국동력기계공학회 (The Korean Society for Power System Engineering)
권호 표지
DOI QR코드

DOI QR Code

담금 냉각되는 LED 조명엔진의 열특성에 대한 연구

Study on the Thermal Behavior of Immersion Cooled LED Lighting Engines

  • 김경준 (부경대학교 기계자동차공학과)
  • Kim, Kyoung Joon (Department of Mechanical & Automotive Engineering, Pukyong National University)
  • 투고 : 2014.04.18
  • 심사 : 2014.06.05
  • 발행 : 2014.06.30
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

This study is aimed at investigating the thermal behavior of immersion-cooled high power LED lighting engines. 3D CFD models have been generated for the numerical analysis. Five cases in terms of the configuration of LED chips have been explored for various passive cooling conditions of the lighting engine, i.e., the natural air convection with a lens, the natural air convection without a lens, the deionized water-immersion cooling condition with a lens. The numerical study reveals that the deionized water-immersion cooled lighting engine has nearly twice better thermal performance than the natural air convection cooled lighting engine containing a lens. The investigation has also demonstrated that the four chips configuration has the better thermal performance than the single chip configuration.

키워드

참고문헌

  1. M. Arik, J. Petroski, and S. Weaver, 2002, "Thermal Challenges in the Future Generation Solid State Lighting Applications: Light Emitting Diodes", Proceedings of the 8th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, United States, pp. 113-120.
  2. P.C. Tsai, R. W. Chang, and Y. K. Su, 2007, "Lifetime Tests and Junction-Temperature Measurement of InGaN Light-Emitting Diodes Using Patterned Sapphire Substrates", Journal of Lightwave Technology, Vol. 25, No. 2, pp. 591-596 https://doi.org/10.1109/JLT.2006.888234
  3. J. Kim, 2013, "Barrier-Transition Cooling in LED", Journal of the Korean Society of Power Engineering, Vol. 17, No. 5, pp. 44-51.
  4. D.-W. Kim, E. Rahim, A. Bar-Cohen, and B. Han, 2010, "Direct Submount Cooling of High-Power LEDs", IEEE Transactions on Components Packaging Technologies, Vol. 33, No. 4, pp. 698-712. https://doi.org/10.1109/TCAPT.2010.2040618
  5. G. Chang, C.M. Park, and E.P. Kim, 2007, "A Study on Development of Liquid Cooled Plate for Cooling of a Communication Electronic Device with High Heat Generation", Journal of the Korean Society of Power Engineering, Vol. 11, No. 2, pp. 26-31.
  6. J.-C. Wang, R.-T. Wang, T.-L. Chang et al., 2010, "Development of 30Watt High Power LEDs Vapor Chamber-Based Plate", International Journal of Heat and Mass Transfer, Vol. 53, No. 19, pp. 3990-4001. https://doi.org/10.1016/j.ijheatmasstransfer.2010.05.018
  7. S. Liu, J. Yang, Z. Gan, et al., 2008, "Structural Optimization of Microjet Based Cooling System for High Power LEDs", International Journal of Thermal Science, Vol. 47, pp. 1086-1095. https://doi.org/10.1016/j.ijthermalsci.2007.09.005
  8. X. Luo and S. Liu, 2007, "A Microjet Array Cooling System for Thermal Management of High-Brightness LEDs", IEEE Transactions on Advanced Packaging, Vol. 30, No. 3, pp. 475-484. https://doi.org/10.1109/TADVP.2007.898522
  9. K. A. Hoffmann, S. T. Chiang, 1998, "Computational Fluid Dynamics Volume I", 3rd Ed., Engineering Education System, Wichita, KS, U.S.A.