참고문헌
- N. Narendran, Y. Gu, J. P. Freyssinier, H. Yu and L. Deng, "Solid-state lighting: Failure analysis of white LEDs", J. Cryst. Growth, 268(3-4), 449 (2004). https://doi.org/10.1016/j.jcrysgro.2004.04.071
- S. Ishizaki, H. Kimura and M. Sugimoto, "Lifetime estimation of high power white LEDs", J. Light & Vis. Env., 31(1), 11 (2007). https://doi.org/10.2150/jlve.31.11
- M. Meneghini, S. Podda, A. Morelli, R. Pintus, L. Trevisanello, G. Meneghesso, M. Vanzi and E. Zanoni, "High brightness GaN LEDs degradation during dc and pulsed stress", Microelectron. Reliab., 46(9-11), 1720 (2006). https://doi.org/10.1016/j.microrel.2006.07.050
- G. Meneghesso, S. Levada, R. Pierobon, F. Rampazzo, E. Zanoni, A. Cavallini, A. Castaldini, G. Scamarcio, S. Du and I. Eliashevich, "Degradation mechanisms of GaN-based LEDs after accelerated DC current aging", Proc. 2002 International Electron Devices Meeting(IEDM), San Francisco, 103, IEEE Components, (2005).
- J. H. Lau, Low Cost Flip chip Technologies, pp.1-17, McGraw-Hill, New York (2000).
- R. R. Tummala, "SOP: What is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade", IEEE Trans. Adv. Packag., 27(2), 241 (2004). https://doi.org/10.1109/TADVP.2004.830354
- R. R. Tummala, and M. Swaminathan, Introduction to Systemon-Package(SOP), pp.7-8, Mcgraw-Hill, New York (2008).
- H. Ye, C. basaran and D. C. Hopkins, "Damage mechanics of microelectronics solder joints under high current densities", Int. J. Solids Struct., 40, 4021 (2003). https://doi.org/10.1016/S0020-7683(03)00175-6
- J. W. Uoon, W. C. Moon and S. B. Jung, "Core technology of electronic packaging", J. Kor. Weld. Soc., 23(2), 10 (2005).
- B. Djurfors and D. G. Ivey, "Microstructural characterization of pulsed electrodeposited Au/Sn alloy thin films", Mater. Sci. Eng. B(90), 309 (2002). https://doi.org/10.1016/S0921-5107(02)00060-0
- Z. Ma, X. Zheng, W. Liu, X. Lin and X. lin, "Fast thermal resistance measurement of high brightness LED", Proc. 6th International Conference on Electronic Packaging Technology(ICEPT), Shenzhen, 1, IEEE Components, (2005).
- T. Ayodha, H. S. Han, S. Y. Kim and S. W. Karng, "Thermal resistance measurement of high Power LEDs". Trans. Kor. Soc. Mech. Eng., 158 (2012).
- M. W. Shin and J. P. Kim, Introduction to LED Packaging Technology, pp.192-195, Bookshill, Seoul (2009).
- H. H. Kim, S. H. Choi, S. H. Shin, Y. G. Lee, S. M. Choi and Y. S. Oh, "Thermal Transient Characteristics of Die Attach in High Power LED Package", J. Microelectron. Packag. Soc., 12(4), 331 (2005).
- "A Study on the Thermal Behaviour of Via Design in the Ceramic Package", J. Microelectron. Packag. Soc., 10(1), 39 (2003).
- H. G. Song, J. P. Ahn and J. W. Morris, "The Microstructure of Eutectic Au-Sn Solder Bumps on Cu/Electroless Ni/Au", J. Electron. Mater., 30(9), 1083 (2001). https://doi.org/10.1007/s11664-001-0133-9
- T. Laurila, V. Vuorinen and J. K. Kivilahti, "Interfacial reactions between lead-free solders and commonbase materials", Mater. Sci. Eng. R, 49(1-2), 1 (2005). https://doi.org/10.1016/j.mser.2005.03.001
- P. G. Kim and K. N. Tu, "Fast dissolution and soldering reactions on Au foils", Mater. Chem. Phys., 53, 165 (1998). https://doi.org/10.1016/S0254-0584(97)02076-2
- J. A. King, "Material Handbook for Hybrid Microelectronics", Artec House, Norwood, MA (1988).
- J. Bilek, J. K. Atkinson and W. A. Wakeham, "Thermal Conductivity of Molten Lead-Free Solders", Inter. J. Thermophys., 27, (2006).
- IPC-A-610D, "Acceptability of Electronic Assemblies", IPC, Bannockburn (2000).
피인용 문헌
- 전기화학적 정전위 활성화를 사용한 수소 제거에 의한 AlGaN기반의 UV-C 발광 다이오드의 p-형 활성화 vol.28, pp.4, 2014, https://doi.org/10.6117/kmeps.2021.28.4.085