참고문헌
- M. T. Domonkos, S. Heidger, D. Brown, J. V. Parker, C. W. Gregg, K. Slenes, W. Hackenberger, S. Kwon, E. Loree and T. Tran, IEEE Trans. Plasma Sci., 38, 2686 (2010). https://doi.org/10.1109/TPS.2010.2049124
- W. J. Sarjeant, J. Zirnheld and F. W. MacDougall, IEEE Trans. Plasma Sci., 26, 1368 (1998). https://doi.org/10.1109/27.736020
- L. Hua, L. Fuchang, Z. Heqing, D. Ling, H. Yongxia and K. Zhonghua, IEEE Trans. Magn., 45, 327 (2009). https://doi.org/10.1109/TMAG.2008.2008863
- J. L. Nash, Polymer Eng. Sci., 28, 862 (1988). https://doi.org/10.1002/pen.760281307
- N. Zebouchi and D. Malec, J. Appl. Phys., 83, 6190 (1998). https://doi.org/10.1063/1.367495
- P. Karanja and R. Nath, IEEE Trans. Electr. Insul., 28, 294 (1993). https://doi.org/10.1109/14.212254
- G. Love, J. Am. Ceram. Soc., 73, 339 (1990).
- G. Brennecka, J. Ihlefeld, J-P. Maria, B. Tuttle and P. Clem, J. Am. Ceram. Soc., 93, 3935 (2010). https://doi.org/10.1111/j.1551-2916.2010.04211.x
- J. Kim, D. Kim, J. Kim, Y. Kim, K. N. Hui and H. Lee, Electron. Mater. Lett., 7, 155 (2011). https://doi.org/10.1007/s13391-011-0612-y
- J. Lim, S. Zhang and T. R. Shrout, Electron. Mater. Lett., 7, 71 (2011). https://doi.org/10.1007/s13391-011-0311-8
- G. H. Jain, L. A. Patil, M. S. Wagh, D. R. Patil, S. A. Patil and D. P. Amalnerkar, Sens. Actuators, B117, 159 (2006).
- F. El. Kamel, P. Gonon, F. Jomni and B. Yangui, J. Eur. Ceram. Soc., 27, 3807 (2007). https://doi.org/10.1016/j.jeurceramsoc.2007.02.038
- J. Zeng, H. Wang, M. Wang, S. Shang, Z. Wang and C. Lin, Thin Solid Films, 322, 104 (1998). https://doi.org/10.1016/S0040-6090(97)00965-6
- D. Kim, S. Lee, Y. Park and S. Park, Mater. Lett., 40, 146 (1999). https://doi.org/10.1016/S0167-577X(99)00065-8
- B. Lee and J. Zhang, Thin Solid Films, 388, 107 (2001). https://doi.org/10.1016/S0040-6090(01)00816-1
- C. H. Wu, J. P. Chu, S. F. Wang, T. N. Lin, W. Z. Chang and V. S. John, Surf. Coat. Technol., 202, 5448 (2008). https://doi.org/10.1016/j.surfcoat.2008.06.112
- Q. X. Jia, Z. Q. Shi and W. A. Anderson, Thin Solid Films, 209, 230 (1992). https://doi.org/10.1016/0040-6090(92)90680-A
- T. Minami, S. Ida and T. Miyata, Thin Solid Films, 416, 93 (2002).
- V. Assuncao, E. Fortunato, A. Marques, H. Aguas, I. Ferreira, M.E.V. Costa and R. Martins, Thin Solid Films, 427, 402 (2003).
- P. K. Song, Y. Irie, S. Ohno, Y. Sato and Y. Shigesato, Jpn. J. Appl. Phys., 43, 442 (2004). https://doi.org/10.1143/JJAP.43.L442
- P. Zeman and S. Takabayashi, Surf. Coat. Technol., 153, 93 (2002). https://doi.org/10.1016/S0257-8972(01)01553-5
- L. I. Maissel and R. Glang, Handbook of Thin Film Technology, p.22, Mcgraw-Hill Inc, New York, USA, (1970).
- S. M. Mukhopadhyay and T. C. S Chen, J. Mater. Res., 10, 1502 (1995). https://doi.org/10.1557/JMR.1995.1502
- S. A. Nasser, Appl. Surf. Sci., 157, 14 (2000). https://doi.org/10.1016/S0169-4332(99)00495-X
- H. Kawano, K. Morii and Y. Nakayama, Mater. Lett., 12, 252 (1991). https://doi.org/10.1016/0167-577X(91)90008-T
- Y. B Chen, C. L. Huang, Surf. Coat. Technol., 201, 643 (2006).