참고문헌
- X. Zhong, X. Guo, Corrosion Sci., 74 (2013) 71. https://doi.org/10.1016/j.corsci.2013.04.015
- H. He, F. Guo, Electron. Mater. Lett., 8 (2012) 463. https://doi.org/10.1007/s13391-012-2019-9
- T. G. Woo, K. W. Seol, Electron. Mater. Lett., 8 (2012) 151. https://doi.org/10.1007/s13391-012-1075-5
- N. B. Aguilera, A. Bossche, IEEE Transactions on Device and Materials. Reliability, 13 (2013) 1. https://doi.org/10.1109/TDMR.2012.2234460
- D. Konno, N. Yoshimura, IEEJ Transactions on Fundamentals and Materials, 133 (2013) 153. https://doi.org/10.1541/ieejfms.133.153
- X. He, M. G. Pecht, IPC APEX EXPO Technical Conference (2012).
- J. B. Chyi, G. S. Shen, Packaging, Assembly, & Circuit Technology Conference, ISBN 978-1-4577-1388-0.
- H. Li, H. Hanna, Wuhan University Journal of Natural Sciences, 17 (2012) 79. https://doi.org/10.1007/s11859-012-0808-5
- V. V. R. Nandigana, N. R. Aluru, Electrochimica Acta, 105 (2013) 514. https://doi.org/10.1016/j.electacta.2013.05.011
- H. Huang, Z. Dong, Corrosion Science, 53 (2011) 3446. https://doi.org/10.1016/j.corsci.2011.04.017
- B. I. Noh, S. B. Jung, Mater Electron., 19 (2008) 952. https://doi.org/10.1007/s10854-007-9421-3
- B. Li, D. Badami, Microelectronics Reliability, 44 (2004) 365. https://doi.org/10.1016/j.microrel.2003.11.004
- M. A. Hussain, F. M. Khoshnaw, IEEE 9th VLSI Packaging Workshop of Japan, 12 (2008) 105.
- Y. Heng Chen, M. Hsiao, 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 7 (2012) 1.
- Konno, Dai, Denki Gakkai Ronbunshi, A Kiso zairy A, 133 (2013) 153.
- X. He, M. G. Pecht, IPC APEX EXPO Technical Conference, (2010) 1297.
- K. Mitobe, Denki Gakkai Ronbunshi. A, Kiso zairyA. 127 (2007) 335.
- D. B. Lee, D. S. Yu, Journal of the Korean Society for Precision Engineering, 9 (2005) 64.
- D. B. Lee, D. S. Yu, Korean Society for Precision Engineering Meeting (2004) 180.
- "IPC-TM 650 2.6.13 Test Method Manual," Assessment of Susceptibility to Metallic Dendritic Growth. 2215 Sanders Road Northbook, IL 60062-6135.