References
- H. Cho, et al., "1.2Gb/s 3.9pJ/b Mono-Phase Pulse Modulation Inductive Coupling Transceiver for mm-Range Board-to-Board Communication" ISSCC Dig. Tech. Papers, pp. 202-203, Feb 2013.
- H. Ishikuro, et al., "Wideband Inductive-coupling Interface for High-performance Portable System," IEEE CICC, pp. 13-20, Sep. 2007.
- D. Mizoguchi et al., "A 1.2Gb/s/pin Wireless Superconnect based on Inductive Inter-Chip Signaling (IIS)," IEEE ISSCC, Dig. Tech. Papers, pp. 142-143, Feb. 2004.
- N. Miura, et al., "Analysis and Design of Inductive Coupling and Transceiver Circuit for Inductive Inter-Chip Wireless Superconnect, " IEEE Journal of Solid-State Circuits, vol. 40, no. 4, pp. 829-837, April 2005. https://doi.org/10.1109/JSSC.2005.845560
- N. Miura, et al., "A 1Tb/s 3W Inductive-Coupling Transceiver for Inter-Chip Clock and Data Link," IEEE ISSCC, Dig. Tech. Papers, pp.424-425, Feb. 2006.
- N. Miura, et al., "A 1Tb/s 3W Inductive-Coupling Transceiver for 3D-Stacked Inter-Chip Clock and Data Link," IEEE Journal of Solid-State Circuits, vol.42, no.1, pp.111-122, Jan. 2007. https://doi.org/10.1109/JSSC.2006.886554
- M. Horowitz, "Current integrating receivers for high speed system interconnects," IEEE CICC, May 1995.
- J. L. Zerbe, et al., "1.6 Gb/s/pin 4-PAM Signaling and Circuits for a Multidrop Bus," IEEE Journal of Solid-State Circuits, vol. 36, no. 5, pp.752-760, May 2001. https://doi.org/10.1109/4.918912
- H. Lee, J.-H. Chun, et. al., "A 16Gb/s/link, 64GB/s bidirectional asymmetric memory interface," IEEE Journal of Solid-State Circuits (JSSC), April 2009.
- Y. Cai, et al., "Jitter Testing for Multi-Gigabit Backplane SerDes - Techniques to Decompose and Combine Various Types of Jitter," Proceedings of IEEE International Test Conference, pp. 700-709, 2002.
- S. Kawai, et al., "A 2.5Gb/s/ch 4PAM Inductive-Coupling Transceiver for Non-Contact Memory Card," ISSCC Dig. Tech., pp. 264-265, Feb. 2010.
- H. Cho, et al., "1.2Gb/s 3.9pJ/b Mono-Phase pulse-Modulation Inductive-Coupling Transceiver for mm-Range Board-to-Board Communication," ISSCC Dig. Tech., pp. 202-203, Feb. 2013.