DOI QR코드

DOI QR Code

Analysis of SMPS Characteristics applying Ground Plane Layer

Ground Plane레이어를 적용한 SMPS 특성분석

  • Received : 2013.12.20
  • Accepted : 2014.01.09
  • Published : 2014.01.31

Abstract

To verity the effect of PCB plane layer to the output characteristics of the Switched Mode Power Supply (SMPS), this paper compared with a generic one-layer PCB and a double-side PCB. This paper specially focused on the voltage, the current and the high frequency noise of the output characteristic of the SMPS, using a double-side PCB which has same layout and was installed a ground plane on the opposite side. This double-side PCB was assembled by all same components which used on the SMPS using the single-side PCB. The experiment results show the SMPS using the ground plan PCB can efficiently reduce the high frequency noise to 50mV at 100MHz from 150mV in the single-side PCB. And the results also show the high harmonics frequency was reduced as well.

본 논문에서는 PCB Plane 레이어가 SMPS에 미치는 영향을 확인하기 위하여 일반적인 단면 PCB와 Plane을 갖는 양면 PCB를 이용한 SMPS의 출력특성을 각각 분석하였다. 그 이후 동일한 레이아웃을 갖는 PCB의 반대 면에 Ground Plane을 설치한 양면PCB를 이용하여 SMPS 기판을 작성하여 단면 PCB SMPS에 적용해서 분석한 모든 부품을 이동 실장한 후 두 SMPS의 출력특성을 전압, 전류, 고주파잡음 측면에서 비교 분석하였다. 그 결과 단면PCB의 SMPS는 100MHz대역의 고주파 잡음이 150mV인 반면, Ground Plane을 설치한 SMPS에서는 50mV로 1/3 저감되는 현상을 확인하였다. 그리고 고주파 잡음 성분 또한 감소됨을 확인하였다.

Keywords

References

  1. S.C. Baik, Y.H. Lee, "Study on the Healthy diagnosis using the PWM and Output Corrugation of SMPS", Conference on Korean Institute of Information Technology, pp26-29, 2006
  2. J.H. Park, "Analysis of Power Transfer and Noise Characteristics for PCB Design of DC/DC Converter" Juournal of KAIS, Vol.10, No.2,pp.264-268, 2009 DOI: http://dx.doi.org/10.5762/KAIS.2009.10.2.264
  3. T.G.Kim, G.B. Chung, W.Y. Lee,"A utilization of PCB capacitor to reduce the output voltage ripple in Flyback SMPS", Conference on Power Electronics, pp.102-105, July, 2003
  4. "Layout Guidelines fr Switching Power Supplies" Texas Instruments, Application Report, AN-1149, Oct. 1999
  5. "EMC Specifications and PCB Guidelines for SMPS Devices",On Semiconductor, AND8301/D, May. 2009