마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제21권4호
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  • Pages.33-39
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  • 2014
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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Four Point Bending Test for Adhesion Testing of Packaging Strictures: A Review

  • Mahan, Kenny (Department of Mechanical Engineering, University of Maryland) ;
  • Han, Bongtae (Department of Mechanical Engineering, University of Maryland)
  • 투고 : 2014.12.10
  • 심사 : 2014.12.24
  • 발행 : 2014.12.30
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초록

To establish the reliability of a packaging structures, adhesion testing of key interfaces is a critical task. Due to the material mismatch, the interface may be prone to delamination failure due to conditions during the manufacturing of the product or just from the day-to-day use. To assess the reliability of the interface adhesion strength testing can be performed during the design phase of the product. One test method of interest is the four-point bending (4PB) adhesion strength test method. This test method has been implemented in a variety of situations to evaluate the adhesion strength of interfaces in bimaterial structures to the interfaces within thin film multilayer stacks. This article presents a review of the 4PB adhesion strength testing method and key implementations of the technique in regards to semiconductor packaging.

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참고문헌

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