Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
권호 표지
DOI QR코드

DOI QR Code

Four Point Bending Test for Adhesion Testing of Packaging Strictures: A Review

  • Mahan, Kenny (Department of Mechanical Engineering, University of Maryland) ;
  • Han, Bongtae (Department of Mechanical Engineering, University of Maryland)
  • Received : 2014.12.10
  • Accepted : 2014.12.24
  • Published : 2014.12.30
Download PDF
⟨ Previous Next ⟩

Abstract

To establish the reliability of a packaging structures, adhesion testing of key interfaces is a critical task. Due to the material mismatch, the interface may be prone to delamination failure due to conditions during the manufacturing of the product or just from the day-to-day use. To assess the reliability of the interface adhesion strength testing can be performed during the design phase of the product. One test method of interest is the four-point bending (4PB) adhesion strength test method. This test method has been implemented in a variety of situations to evaluate the adhesion strength of interfaces in bimaterial structures to the interfaces within thin film multilayer stacks. This article presents a review of the 4PB adhesion strength testing method and key implementations of the technique in regards to semiconductor packaging.

Keywords

References

  1. J. G. Williams, "Large Displacement and End Block Effects in the 'DCB' Interlaminar Test in Modes I and II", Journal of Composite Materials, 21, 330 (1987). https://doi.org/10.1177/002199838702100403
  2. A. G. Evans, M. Ruhle, B. J. Dalgleish and P. G. Charalambides, "The fracture energy of bimaterial interfaces", Met. Trans. A, 21(9), 2419 (1990). https://doi.org/10.1007/BF02646986
  3. X. Dai, "Materials study for interfacial adhesion and reliability of microelectronics packaging structures", Doctor of Philosophy, The University of Texas, Austin, (1998).
  4. X. Dai, M. V. Brillhart and P. S. Ho, "Polymer interfacial adhesion in microelectronic assemblies", Proc. 48th Electronic Components and Technology Conference (ECTC), Seattle, WA, 132, IEEE (1998).
  5. X. Dai, M. V. Brillhart and P. S. Ho, "Adhesion measurement for electronic packaging applications using double cantilever beam method", Components and Packaging Technologies, IEEE Transactions on, 23, 101 (2000). https://doi.org/10.1109/6144.833049
  6. D. K. Shin, H. S. Lee and J. Im, "Chemical and Mechanical Analysis of PCB Surface Treated by Argon Plasma to Enhance Interfacial Adhesion", Electronics Packaging Manufacturing, IEEE Transactions on, 32(4), 281 (2009). https://doi.org/10.1109/TEPM.2009.2029700
  7. D. K. Shin, Y. H. song and J. Im "Effect of PCB Surface Modifications on the EMC-to-PCB Adhesion in Electronic Packages", Components and Packaging Technologies, IEEE Transactions on, 33(2), 498 ( 2010). https://doi.org/10.1109/TCAPT.2010.2047018
  8. X. Yan and R. K. Agarwal, "Two test specimens for determining the interfacial fracture toughness in flip-chip assemblies", Journal of Electronic Packaging, 120(2), 150 (1998). https://doi.org/10.1115/1.2792607
  9. P. G. Charalambides, J. Lund, A. G. Evans and R. M. McMeeking, "A test specimen for determining the fracture resistance of bimaterial interfaces", J. Appl. Mech., 56(1), 77 (1989). https://doi.org/10.1115/1.3176069
  10. R. H. Dauskardt, M. Lane, Q. Ma and N. Krishna, "Adhesion and debonding of multi-layer thin film structures", Engineering Fracture Mechanics, 61(1), 141 (1998). https://doi.org/10.1016/S0013-7944(98)00052-6
  11. Z. Huang, Z. Suo, Z. Xu, J. He, J. H. Prevost and N. Sukumar, "Initiation and arrest of an interfacial crack in a four-point bend test", Engineering Fracture Mechanics, 72(17), 2584 (2005). https://doi.org/10.1016/j.engfracmech.2005.04.002
  12. H. Tran, M. H. Shirangi, X. Pang and A. A. Volinsky, "Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness", Int. J. Fract., 185(1-2), 115 (2014). https://doi.org/10.1007/s10704-013-9907-3
  13. T. L. Anderson, "Fracture mechanics: fundamentals and applications", CRC Press, (2005).
  14. C. S. Bischof, "Relationship of Adhesion, Delamination, Preconditioning and Preplating Effects at the Plastic to Leadframe Interface", Proc. 45th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 827, IEEE (1995).
  15. L. K. Teh, M. Teo, E. Anto, C. C. Wong, S. G. Mhaisalkar, P. S. Teo and E. H. Wong, "Moisture-induced failures of adhesive flip chip interconnects", IEEE Transactions on Components and Packaging Technologies, 28(3), 506 (2005). https://doi.org/10.1109/TCAPT.2005.848572
  16. J. R. Rice, "A path independent integral and the approximate analysis of strain concentration by notches and cracks", Journal of Applied Mechanics, 35(2), 379 (1968). https://doi.org/10.1115/1.3601206
  17. J. R. Rice, "Elastic fracture mechanics concepts for interfacial cracks", J. Appl. Mech., 55(1), 98 (1988). https://doi.org/10.1115/1.3173668
  18. A. G. Evans, "The mechanical performance of fiber-reinforced ceramic matrix composites", Materials Science and Engineering: A, 107, 227 (1989). https://doi.org/10.1016/0921-5093(89)90391-2
  19. P. G. Charalambides, H. C. Cao, J. Lund and A. G. Evans, "Development of a test method for measuring the mixedmode fracture-resistance of bimaterial interfaces", Mechanics of Materials, 8(4), 269 (1990). https://doi.org/10.1016/0167-6636(90)90047-J
  20. B. Kim, T. Matthias, E. Cakmak, E. J. Jang, J. W. Kim and Y. B. Park, "Interfacial properties of Cu-Cu direct bonds for TSV integration", Solid State Technology, 53(8), 18 (2010).
  21. R. Arima, F. Inoue, H. Miyake, T. Shimizu and S. Shingubara, "Control of adhesion strength and TSV filling morphology of electroless barrier layer", ESC Transactions, 50(32), 13 (2013).
  22. M. Shirangi, W. H. Muller and B. Michel, "Determination of Copper/EMC interface fracture toughness during manufacturing, moisture preconditioning and solder reflow process of semiconductor packages", ICF12, Ottawa 2009 (2013).
  23. M. H. Shirangi, "Simulation-based Investigation of Interface Delamination in Plastic IC Packages under Temperature and Moisture Loading", Cuvillier (2010).
  24. M. H. Shirangi and B. Michel, "Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds", Moisture Sensitivity of Plastic Packages of IC Devices., pp.29-69, Springer US (2010).