References
- J. H. Ming and W. C. Lin, Nanotechnology 20, 0256081 (2009).
- A. K. Geim and K. S. Novoselov, Nat. Mater 6, 183 (2007). https://doi.org/10.1038/nmat1849
- Z. L. Tsakadze, I. Levchenko, K. Ostrikov, and S. Xu, Carbon 45 2022 (2007). https://doi.org/10.1016/j.carbon.2007.05.030
- D. Fejes and K. Hernadi, Materials 3, 2618 (2010). https://doi.org/10.3390/ma3042618
- L. J. Pan, T. Hayashida, M. Zhang and Y. Nakayama, Jpn. J. Appl. Phys. 40, L235 (2001). https://doi.org/10.1143/JJAP.40.L235
- S. Amelinckx, X. B. Zhang, D. Bernaerts, X. F. Zhang, V. Ivanov, and J. B. Nagy, Science 265, 635 (1994). https://doi.org/10.1126/science.265.5172.635
- S. Hokushin, L. J. Pan, Y. Konishi, H. Tanaka, and Y. Nakayama, Jpn. J. Appl. Phys. 46, L565 (2007). https://doi.org/10.1143/JJAP.46.L565
- C. W. Xu, L. Q. Cheng, P. K. Shen, and Y. L. Liu, Electrochem. Commun. 9, 997 (2007). https://doi.org/10.1016/j.elecom.2006.12.003
- D. S. Yuan, S. Z. Tan, Y. L. Liu, J. H. Zeng, and F. P. Hu, Carbon 46, 531 (2008). https://doi.org/10.1016/j.carbon.2008.01.004
- E. Antolini, Appl. Catal. B 88, 1 (2009). https://doi.org/10.1016/j.apcatb.2008.09.030
- V. Hacker, E. Wallnofer, W. Baumgartner, T. Schaffer, J. O. Besenhard, and H. Schrottner, Electrochem. Commun. 7, 377 (2005). https://doi.org/10.1016/j.elecom.2005.02.009
- M. Tsuji, M. Kubokawa, R. Yano, N. Miyamae, T. Tsuji, M. S. Jun, S. Hong, S. Lim, S. H. Yoon, and I. Mochida, Langmuir 23, 387 (2007). https://doi.org/10.1021/la062223u
- C. C. Chien and K. T. Jeng, Mater. Chem. Phys. 99, 80 (2006). https://doi.org/10.1016/j.matchemphys.2005.09.080
- S. Motojima, S. Asakura, T. Kasemura, S. Takeuchi, and H. Iwanaga, Carbon 34, 289 (1996). https://doi.org/10.1016/0008-6223(95)00169-7
- S. Yang, X. Chen, and S. Motojima, Carbon 44, 3352 (2004).
- X. Chen and S. Motojima, Carbon 37, 1817 (1999). https://doi.org/10.1016/S0008-6223(99)00054-8
- S. H. Kim, J. Korean Vac. Soc. 20, 374 (2011). https://doi.org/10.5757/JKVS.2011.20.5.374
- S. H. Kim, J. Korean Vac. Soc. 21, 48 (2012). https://doi.org/10.5757/JKVS.2012.21.1.48
- S. H. Kim, J. Korean Vac. Soc. 20, 374 (2011). https://doi.org/10.5757/JKVS.2011.20.5.374
- N. Kniffer, A. Pfluegaer, T. Schulz, Sven Sommer, and B. Schroeder, Thin Solid Films 519, 4582 (2011). https://doi.org/10.1016/j.tsf.2011.01.324
- S. G. Ri, H. Watanabe, M. Ogura, D. Takeuchi, S. Yamasaki, H. Okushi, and J. Cryst. Growth 293, 311 (2006). https://doi.org/10.1016/j.jcrysgro.2006.05.036
- F. N. Dultsev and L. A. Nenasheva, Appl. Surf. Science 253, 1287 (2006). https://doi.org/10.1016/j.apsusc.2006.01.073
- C. A. Figueroa and F. Alvarez, Appl. Surf. Science 253, 1806 (2006). https://doi.org/10.1016/j.apsusc.2006.03.015
- S. Park, Y. C. Jeon, and S. H. Kim, to be published in ECS Solid State Science & Technology (2013).
- M. Kawaguchi, K. Nozaki, S. Motojima, and H. Iwanaga, J. Cryst. Growth 118, 309 (1992). https://doi.org/10.1016/0022-0248(92)90077-V
- S. Park, S. H. Kim, and T. G. Kim, J. Nanomaterials 2012 Article ID 389248 (2012).
- H. Tada, A. E. Kumpel, R. E. Lathrop, J. B. Slanina, P. Nieva, P. Zavracky, I. N. Miaoulis, and P. Y. Wong, Journal of Applied Physics I 87, 4189 (2000). https://doi.org/10.1063/1.373050
- T. G. Kollie, Physical Review B 16, 4872 (1977). https://doi.org/10.1103/PhysRevB.16.4872
- Q. Zhang, L. Yu, and Z. Cui, Mater. Res. Bull. 43, 735 (2008). https://doi.org/10.1016/j.materresbull.2007.03.022