Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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A Study on the Surface Modification Mechanism of Copper Foil Using O2 / Ar Plasma

O2 / Ar 플라즈마를 이용한 구리호일 표면 개질에 관한 연구

  • Lee, Jongchan (Department of Control and Instrumentation, Korea University) ;
  • Son, Jinyoung (Department of Control and Instrumentation, Korea University) ;
  • Kim, Moonkeun (Department of Control and Instrumentation, Korea University) ;
  • Kwon, Kwang-Ho (Department of Control and Instrumentation, Korea University) ;
  • Lee, Hyunwoo (Division of Electronic, Computer and Communication Engineering, Hanseo University)
  • 이종찬 (고려대학교 제어계측공학과) ;
  • 손진영 (고려대학교 제어계측공학과) ;
  • 김문근 (고려대학교 제어계측공학과) ;
  • 권광호 (고려대학교 제어계측공학과) ;
  • 이현우 (한서대학교 전자컴퓨터통신공학부)
  • Received : 2013.09.06
  • Accepted : 2013.10.14
  • Published : 2013.11.01
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Abstract

In this study, the surface modification of copper foil using an inductively coupled $O_2$ / Ar plasma as $O_2$ gas fraction (0~100%) was investigated in order to improve the surface characteristics. After plasma treatment, the measurement of the surface roughness, surface contact angle and surface energy were performed for the surface analysis of copper foil. As a result, the surface roughness and the surface energy were increased. And plasma diagnostics was performed by a double Langmuir probe (DLP) and optical emission spectroscopy (OES). Using these results, the plasma surface modification mechanism was investigated.

Keywords

References

  1. X. Ye, M. De Bonte, J. P. Celis, and J. R. Roos, J. Electrochem. Soc., 139, 1592 (1992). https://doi.org/10.1149/1.2069461
  2. J. W. Braithwaite, G. Angelo, N. Ganesan, and J. L. Samuel. J. Electrochem Soc., 146, 448 (1999). https://doi.org/10.1149/1.1391627
  3. N. Tamura, R. Ohshita, M. Fujimoto, M. Kamino, and S. Fujitani, J. Electrochem. Soc., 150, A679 (2003). https://doi.org/10.1149/1.1568108
  4. E. T. Kang, K. L. Tan, K. Kato, Y. Uyama, and Y. Ikada, J. Macromolecules, 29, 6872 (1996). https://doi.org/10.1021/ma960161g
  5. J. R. Chen and T. Wakida, J. Appl. Polym. Sci. 63, 1733 (1997). https://doi.org/10.1002/(SICI)1097-4628(19970328)63:13<1733::AID-APP4>3.0.CO;2-H
  6. D. K. Owens and R. C. Wendt, J. Appl. Polym. Sci., 13, 1741 (1969). https://doi.org/10.1002/app.1969.070130815
  7. B. K. Kim, K. S. Kim, C. E. Park, and C. M. Ryu, J. Adhesion Sci. Technol., 16, 509 (2002). https://doi.org/10.1163/156856102760070349
  8. S. J Cho, J. W Choi, and I. S Bae, J. Appl Phys., 50, 01AK02 (2011). https://doi.org/10.7567/JJAP.50.01AK02
  9. C. R. Aita, J. Vac. Sci. Technol., A3, 625 (1985).
  10. K. H. Kwon, A. Efremov, M. Kim, N. K. Min, J. Jeong, M. Hong, and K. Kim, J. Vac. Sci. Technol., A28, 226 (2010).