Bulletin of the Korean Chemical Society

Korean Chemical Society (대한화학회)
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Alkoxysilane Adhesion Promoter for Ag Nano-Ink

  • Hong, Jun Ui (Department of Chemistry, Kongju National University) ;
  • Kumar, A.B.V. Kiran (Department of Chemistry, Kongju National University) ;
  • Han, Hyuon Suk (Department of Chemistry, Kongju National University) ;
  • Koo, Yong Hwan (Radiation Integrated System Research Division, Korea Atomic Ednergy Research Institute (KAERI)) ;
  • Kim, Hye Won (Radiation Integrated System Research Division, Korea Atomic Ednergy Research Institute (KAERI)) ;
  • Park, Ji Hyun (Laser & Plasma Engineering, University of Science and Technology (UST)) ;
  • Kang, Hyun Suk (Radiation Integrated System Research Division, Korea Atomic Ednergy Research Institute (KAERI)) ;
  • Lee, Byung Cheol (Radiation Integrated System Research Division, Korea Atomic Ednergy Research Institute (KAERI)) ;
  • Piao, Longhai (Department of Chemistry, Kongju National University) ;
  • Kim, Sang-Ho (Department of Chemistry, Kongju National University)
  • Received : 2013.04.11
  • Accepted : 2013.05.29
  • Published : 2013.08.20
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References

  1. Perelaer, J.; de Gans B. J.; Schubert, U. S. Adv. Mater. 2006, 18, 2101. https://doi.org/10.1002/adma.200502422
  2. Wu, Y.; Li, Y.; Ong, B. S. J. Am. Chem. Soc. 2007, 129, 1862. https://doi.org/10.1021/ja067596w
  3. Kim, S. J.; Lee, J. S. Nano Lett. 2010, 10, 2884. https://doi.org/10.1021/nl1009662
  4. Shih, Y. C.; Lin, Y. H.; You, J. P.; Shi, F. J. Electron. Mater. 2013, 42, 410. https://doi.org/10.1007/s11664-012-2378-x
  5. Wan, H. C.; Hyun, J. H.; Seung, H. L.; Hak, S. K. Nanotechnology 2013, 24, 035202. https://doi.org/10.1088/0957-4484/24/3/035202
  6. Lee, Y. I.; Choa, Y. H. J. Mater. Chem. 2012, 22, 12517. https://doi.org/10.1039/c2jm31381b
  7. Vaseem, M.; Lee, K. M.; Hong, A. R.; Hahn, Y. B. ACS Appl. Mater. Interfaces 2012, 4, 3300. https://doi.org/10.1021/am300689d
  8. Torrisi, F.; Hasan, T.; Wu, W.; Sun, Z.; Lombardo, A.; Kulmala, T. S. ACS Nano 2012, 6, 2992. https://doi.org/10.1021/nn2044609
  9. Woo, K.; Kim, Y.; Lee, B.; Kim, J.; Moon, J. ACS Appl. Mater. Interfaces 2011, 3, 2377. https://doi.org/10.1021/am2002907
  10. Jang, D.; Kim, D.; Lee, B.; Kim, S.; Kang, M.; Min, D. Adv. Funct. Mater. 2008, 18, 2862. https://doi.org/10.1002/adfm.200800238
  11. Kim, D.; Kim, H. J. Am. Ceram. Soc. 2013, 96, 2006.
  12. Che, Q.; Yang, H.; Lu, L.; Wang, Y. J. Alloys Compd. 2013, 549, 221. https://doi.org/10.1016/j.jallcom.2012.09.080
  13. Kalio, A.; Leibinger, M.; Filipovic, A.; Kruger, K.; Glatthaar, M. J. Sol. Energy Mater. Sol. Cells 2012, 106, 51. https://doi.org/10.1016/j.solmat.2012.05.044
  14. Tee, D. I.; Mariatti, M.; Azizan, A.; See, C. H.; Chong, K. F. Composites Sci. and Tech. 2007, 67, 2584. https://doi.org/10.1016/j.compscitech.2006.12.007

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