DOI QR코드

DOI QR Code

Measurement of thermal contact resistance at Cu-Cu interface

  • 투고 : 2013.05.20
  • 심사 : 2013.06.26
  • 발행 : 2013.06.30

초록

The thermal contact resistance (TCR) is one of the important components in the cryogenic systems. Especially, cryogenic measurement devices using a cryocooler can be affected by TCR because the systems have to consist of several metal components in contact with each other for heat transferring to the specimen without cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement device using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as roughness of metal surface, contact area and contact pressure. In this study, we designed TCR measurement system at various temperatures using a cryocooler as a heat sink and used steady state method to measure the TCR between metals. The copper is selected as a specimen in the experiment because it is widely used as a heat transfer medium in the cryogenic measurement devices. The TCR between Cu and Cu is measured for various temperatures and contact pressures. The effect of the interfacial materials on the TCR is also investigated.

키워드

참고문헌

  1. H. Fujishiro, T. Okamoto, and K. Hirose, "Thermal contact resistance between high-$T_c$ superconductor and copper," Physica C,. 357-360, pp. 785-788, 2001. https://doi.org/10.1016/S0921-4534(01)00364-1
  2. C. Fieberg, R. Kneer, "Determination of thermal contact resistance from transient temperature measurements," International Journal of Heat and Mass Transfer, vol. 51, pp. 1017-1023, 2008. https://doi.org/10.1016/j.ijheatmasstransfer.2007.05.004
  3. Dongmei Bi, Huanxin Chen and Ye Tian, "Influences of temperature and contact pressure on thermal contact resistance at interfaces at cryogenic temperatures," Cryogenics, vol. 52, pp. 403-409, 2012. https://doi.org/10.1016/j.cryogenics.2012.03.006
  4. Tetsuya Baba and Akira Ono, "Improvement of the laser flash method to reduce uncertainly in thermal diffusivity measurements," Measurement Science and Technology, vol. 12, pp. 2046-2057, 2001. https://doi.org/10.1088/0957-0233/12/12/304
  5. June Yu, A. L. Yee and R. E. Schwall, "Thermal conductance of Cu/Cu and Cu/Si interfaces from 85 K to 300 K," Cryogenics, vol. 32, No.7, pp. 610-615, 1992. https://doi.org/10.1016/0011-2275(92)90291-H
  6. Ruiping Xu, Haidong Feng, Lanping Zhao and Lie Xu, "Experimental investigation of thermal contact conductance at low temperature based on fractal description," International Communications in Heat and Mass Transfer, vol. 33, pp. 811-818, 2006. https://doi.org/10.1016/j.icheatmasstransfer.2006.02.023
  7. K. Nishino, S. Yamashita and K. Torii, "Thermal contact Conductance Under Low Applied Load in a Vacuum Exvironment," Experimental Thermal and Fluid Science., vol. 10, pp. 258-271, 1995. https://doi.org/10.1016/0894-1777(94)00091-L
  8. R. C. Juvinall, Fundamentals of Machine Component Design, John Wiley & Sons, 1991.
  9. F. P. Incropera and D. P. Dewitt, Fundamentals of Heat and Mass Transfer, John Wiley & Sons, 1996.

피인용 문헌

  1. Conductive link between cryocooler and magnet in cryogen-free LTS magnet system vol.15, pp.4, 2013, https://doi.org/10.9714/psac.2013.15.4.059