Journal of Electrochemical Science and Technology

The Korean Electrochemical Society (한국전기화학회)
권호 표지
DOI QR코드

DOI QR Code

Electroplating of Nickel on Nickel Titanate Modified Mild Steel Surface

  • Beenakumari, K.S. (Department of Chemistry, All Saints' College)
  • Received : 2013.03.18
  • Accepted : 2013.06.14
  • Published : 2013.06.30
Download PDF
⟨ Previous Next ⟩

Abstract

Nickel is a good electrocatalytic metal and nickel electrodes find many applications in different electrochemical fields. The nickel plated electrodes were prepared by electro-deposition technique on mild steel surface modified with in-situ deposition of nickel titanate. The SEM images shows that the nickel plating on nickel titanate modified mild steel shows better adherence than the nickel plating on bare mild steel surfaces. The extent of polarization of the nickel plating on mild steel with nickel titanate was lower than that of nickel plating on mild steel. The incorporation of nickel titanate on mild steel surface before nickel plating enhances physical, chemical and electrochemical properties of the plating film.

Keywords

References

  1. A. Surca, B. Orel, B. Pihlar and P. Bukovec, J. Electroanal. Chem., 408, 83 (1996) https://doi.org/10.1016/0022-0728(96)04509-3
  2. P. D. Vidts, J. Delgado, B. Wu, D. See, K. Kosanovich and R. E. White, J. Electrochem. Soc., 145, 3874 (1998) https://doi.org/10.1149/1.1838887
  3. J. S. Do and T. C. Chou, J. Appl. Electrochem., 22, 966 (1992) https://doi.org/10.1007/BF01024145
  4. J. S. Do and T. C. Chou, J. Appl. Electrochem., 20, 978 (1990) https://doi.org/10.1007/BF01019575
  5. Y. L. Chen and T. C. Chou, Ind. Eng. Chem. Res., 35, 2172 (1996) https://doi.org/10.1021/ie950502z
  6. R. Kostechi and F. Mclarnon, J. Electrochem. Soc., 144, 485 (1997) https://doi.org/10.1149/1.1837437
  7. K. W. Park, J. H. Choi, B. K. Kwon, S. A. Lee and Y. E. Sung, J. Phys. Chem. B, 106, 1869 (2002) https://doi.org/10.1021/jp013168v
  8. O. Yamamoto, Y. Takeda, R. Kanno and M. Noda, Solid State Ion., 22, 241 (1987). https://doi.org/10.1016/0167-2738(87)90039-7
  9. N. Dharmaraj, H. C. Park, C. K. Kim, H. Y. Kim and D. R. Lee, Mater. Chem. and Phys., 87, 5 (2004). https://doi.org/10.1016/j.matchemphys.2004.05.005
  10. M. S. Sadjadi, K. Zare, S. Khanahmadzadeh and M. Enhessari, Mater. Lett., 62, 3679 (2008). https://doi.org/10.1016/j.matlet.2008.04.028
  11. Y. Shimizu, K. Uemura, N. Miura and N. Yamzoe, Chem. Lett., 67, 1979 (1988).
  12. H. Obayashi, Y. Sakurai and T. Gejo, J. Solid State Chem., 17, 299 (1976). https://doi.org/10.1016/0022-4596(76)90135-3
  13. R. S. Singh, T. H. Ansari, R. A. Singh and B. M. Wanklyn, Mater. Chem. Phys., 50, 173 (1995).
  14. D. J. Taylor, P. F. Fleg and R. A. Page, Thin Solid Films, 408, 104 (2002). https://doi.org/10.1016/S0040-6090(02)00143-8
  15. A. Vadivel Murughan, Violet Samuel, S. C. Navale and V. Ravi, Mater. Lett., 60, 1791 (2006). https://doi.org/10.1016/j.matlet.2005.12.023
  16. M. Lerch, H. Boysen, R. Nerder, F. Frey and W. Laqua, J. Phys. Chem. Solids, 53, 1153 (1992). https://doi.org/10.1016/0022-3697(92)90032-9
  17. C. Marcilly, P. Courty and B. J. Delmon, J. Am. Ceram. Soc., 53, 56 (1970). https://doi.org/10.1111/j.1151-2916.1970.tb12003.x
  18. R. A. Page, C. R. Blanchard-Ardid and W. Wei, J. Mater. Sci., 23, 946 (1988). https://doi.org/10.1007/BF01153994