Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Effect of Process Parameters on Surface Roughness in Lapping Operation

래핑의 공정변수가 표면거칠기에 미치는 영향

  • Choi, Mansung (School of Mechatronics Engineering, Korea University of Technology and Education)
  • 최만성 (한국기술교육대학교 메카트로닉스공학부)
  • Received : 2013.11.04
  • Accepted : 2013.11.30
  • Published : 2013.12.31
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Abstract

Lapping is a very complicated and random process resulting from the variation of abrasive grains in its sizes and shapes and from the numerous factors having an effect on the process quality. This paper presents a study of a $2^4$ full factorial experimental design and analysis to optimize surface quality in lapping operation. The optimization of the factors to obtain minimum surface roughness was carried out by incorporating effect plots, main effect plots, interaction plots, analysis of variance(ANOVA), surface plots, and contour plots. The statistical design experiments, designed to reduce the total number of experiments required, indicated that, within the selected conditions, all the parameters influenced at a significance level of 5%. In addition, some of the possible interactions between these parameters also influenced the lapping process, especially those that were of third order. A regression model was suggested and fitted the experimental data very well.

Keywords

References

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