반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

CMP 공정에서 연마패드 경도에 따른 연마 특성 변화 분자동력학 연구

Molecular Dynamics Study on Property Change of CMP Process by Pad Hardness

  • 권오근 (세명대학교 전자공학과) ;
  • 최태호 (상명대학교 컴퓨터정보통신공학과) ;
  • 이준하 (상명대학교 컴퓨터시스템공학과)
  • Kwon, Oh Kuen (Department of Electronic Engineering, Semyung University) ;
  • Choi, Tae Ho (Department of Computer Information Telecommunication Engineering, Sangmyung University) ;
  • Lee, Jun Ha (Department of Computer System Engineering, Sangmyung University)
  • 투고 : 2013.03.04
  • 심사 : 2013.03.18
  • 발행 : 2013.03.31
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초록

We investigated the wearable dynamics of diamond spherical abrasive during the substrate surface polishing under the pad compression via classical molecular dynamics modeling. We performed three-dimensional molecular dynamics simulations using the Morse potential functions for the copper substrate and the Tersoff potential function for the diamond abrasive. The pad hardness had a big impact on the wearable dynamics of the abrasive. The moving speed of the abrasive decreased with increasing hardness of the pad. As the hardness decreased, the abrasive was indented into the pad and then the sliding motion of the abrasive was increased. So the pad hardness was greatly influenced on the slide-to-roll ratio as well as the wearable rate.

키워드

참고문헌

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