전기학회논문지P (The Transactions of the Korean Institute of Electrical Engineers P)

  • 제62권1호
  • /
  • Pages.6-11
  • /
  • 2013
  • /
  • 1229-800X(pISSN)
  • /
  • 2586-7792(eISSN)
대한전기학회 (The Korean Institute of Electrical Engineers)
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배전용 몰드변압기의 온도특성 파악을 위한 열유동해석

Thermal Fluid Flow Analysis for Temperature Characterization of Mold Transformer in Distribution Power System

  • 투고 : 2012.11.20
  • 심사 : 2012.12.27
  • 발행 : 2013.03.01
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초록

In this paper, the temperature characteristics of mold transformer for the distribution power system have been analyzed by using computational fluid dynamics(CFD). The model has been modeled by coil, cores, insulating materials and frames about 3MVA grade mold transformer and analyzed the temperature distribution of the structure with a heat fluid. The fluid, which is incompressible ideal gas, is analyzed as a turbulent flow phenomenon on the assumption that it is natural cooling of transformer cooling system. Through this study, by examining the temperature distribution and hot-spot of the structure field of the mold transformer, cooling design and temperature distribution information, which are demanded for designing are estimated.

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참고문헌

  1. Bharat Heavy Electricals Limited, "Transformers", McGraw-Hill, 2003
  2. Takeshi Takahashi "Evaluation of the Long-term- Reliability of the Outdoor Mold Transformers using Epoxy Resin", Takaoka Review, Vol.39, No. 2, 1992
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  4. T. Chao, "Solid cast transformers", IEEIAS Pulp Paper Conf, pp. 140-147, 1991
  5. IEEE Guide for Loading Dry-Type Distribution and Power Transformers, IEEE Std C57.96, pp. 5-13, 1999.
  6. Fernandes-Costa, "Prevision of The Thermal Behavior of Dry Type Case Resin Transformers", Electric Machines and Power Systems, Vol. 20, pp.261-272, 1992 https://doi.org/10.1080/07313569208909589
  7. Takashi Hasegawa, "Application Technology of Molded Products in the Field", Takaoka Review, Vol. 43, No. 4, pp. 66-72, 1996.
  8. H. G. Cho, The Temperature Distribution and Thermal Stress Analysis of Pole Mold Transformer, Journal of KIEEME, Vol. 14, No. 4, pp. 297-301, 2001.