Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Trends on Synthesis of Cu Nanoparticles by a Wet Reduction Method

습식 환원법에 의한 Cu 나노입자의 합성 동향

  • Shin, Yong Moo (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Chee, Sang-Soo (Department of Materials Science and Engineering, Seoul National University of Science and Technology) ;
  • Lee, Jong-Hyun (Department of Materials Science and Engineering, Seoul National University of Science and Technology)
  • 신용무 (서울과학기술대학교 신소재공학과) ;
  • 지상수 (서울과학기술대학교 신소재공학과) ;
  • 이종현 (서울과학기술대학교 신소재공학과)
  • Received : 2013.09.06
  • Accepted : 2013.09.27
  • Published : 2013.09.30
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Abstract

Interest in copper nanoparticles has increased as an alternative for substituting silver nanoparticles because of its lower cost and less electromigration effect than silver. In this paper, the recent research trends and main results in wet-chemical synthesis of sub-100 nm Cu nanoparticles were summarized. The characteristics of synthesis were discussed with a classification such as modified polyol synthesis, modified hydrothermal synthesis, solvothermal synthesis, and the others, focussing on effects of capping agents, reductants, and pH. Information on the oxidation of synthesized copper nanoparticles were additionally commented.

Keywords

References

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