Particle and aerosol research (한국입자에어로졸학회지)

Korean Association for Particle and Aerosol Research (한국입자에어로졸학회)
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Evaluation of Point-Of-Use (POU) Filters Performance in Chemical Mechanical Polishing Slurry Supply System

슬러리 공급 시스템을 이용한 화학적 기계적 연마 공정에서의 POU 필터의 성능 평가

  • Jang, Sunjae (School of Mechanical Engineering, Sungkyunkwan University) ;
  • Kim, Hojoong (CMP Technology and Cleaning Team, SAMSUNG Electronics) ;
  • Jin, Hongi (SKKU Advanced Institute of Nanotechnology(SAINT), Sungkyunkwan University) ;
  • Nam, Miyeon (R&D institute, Woongjin chemical co., Ltd.) ;
  • Kulkarni, Atul (School of Mechanical Engineering, Sungkyunkwan University) ;
  • Kim, Taesung (School of Mechanical Engineering, Sungkyunkwan University)
  • Received : 2013.12.04
  • Accepted : 2013.12.18
  • Published : 2013.12.30
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Abstract

The chemical mechanical polishing (CMP) process is widely used in semiconductor manufacturing process for planarization of various materials and structures. Point-of-use (POU) filters are used in most of the CMP processes in order to reduce the unwanted micro-scratches which may result in defects. The performance of the POU filter is depends on type and size of the abrasives used during cleaning process. For this reason, there is a need to evaluate POU filters for their filtration efficiency (FE) with different types of abrasives. In this study, we developed filter test system to evaluate the FE of POU using ceria and silica abrasives (slurry). The POU filter is roll type capsule filter with retention size of 0.2 ${\mu}m$. Two POU filters of different make are evaluated for FE. We observed that both POU filters show similar filtration efficiency for silica and ceria slurry. Results reveal that the ceria slurry and the colloidal silica particle are removed not only by mechanical way but also hydrodynamic and electrostatic interaction way.

Keywords

References

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  1. Development of point-of-use filter evaluation method using chemical mechanical planarization slurry vol.12, pp.4, 2013, https://doi.org/10.11629/jpaar.2016.12.31.145