참고문헌
- R. Sarathi, R. K. Sahu, and P. Rajeshkumar, Mater. Sci. Eng., A445, 567 (2007).
- N. Hayakawa, H. Maeda, S. Chigusa, and H. Okubo, Cryogenics, 40, 167 (2000). https://doi.org/10.1016/S0011-2275(00)00024-2
- B. Jo, S. Park, and D. Kim, Construct. Building Mater., 22, 14 (2008). https://doi.org/10.1016/j.conbuildmat.2007.02.009
- A. Yasmin, J. L. Abot, and I. M. Daniel, Scr. Mater., 49, 81 (2003). https://doi.org/10.1016/S1359-6462(03)00173-8
- A. Yasmin, J. J. Luo, and I. M. Daniel, Compos. Sci. Technol., 66, 1182 (2006). https://doi.org/10.1016/j.compscitech.2005.10.014
- D. C. Lee and L. W. Jang, J. Appl. Polym. Sci., 68, 1997 (1998). https://doi.org/10.1002/(SICI)1097-4628(19980620)68:12<1997::AID-APP14>3.0.CO;2-P
- H. R. Dennis, D. Hunter, D. Chang, S. Kim, and D. R. Paul, Polymer, 42, 9513 (2001). https://doi.org/10.1016/S0032-3861(01)00473-6
- R. A. Vaia, K. D. Jant, E. J. Kramer, E. P. Giannelis, Chem. Mater., 8, 2628 (1996). https://doi.org/10.1021/cm960102h
- J. J. Park and J. Y. Lee, IEEE Trans. Dielectr. Electr. Insul., 17, 1516 (2010). https://doi.org/10.1109/TDEI.2010.5595553
- J. J. Park, C. H. Lee, J. Y. Lee, and H. D. Kim, IEEE Trans. Dielectr. Electr. Insul., 18, 667 (2011). https://doi.org/10.1109/TDEI.2011.5931051
- S. D. Burnside and E. P. Giannelis, Chem. Mater., 7, 1597 (1995). https://doi.org/10.1021/cm00057a001
- J. H. Park and S. Jana, Macromolecules, 36, 2758 (2003). https://doi.org/10.1021/ma021509c
- F. Hussain, M. Hojjati, M. Okamoto, and R. E. Gorga, J. Compos. Mater., 40, 1511 (2006). https://doi.org/10.1177/0021998306067321
- C. L. Wu, M. Q. Zhang, M. Z. Rong, and K. Friedrich, Compos. Sci. Technol., 62, 1327 (2002). https://doi.org/10.1016/S0266-3538(02)00079-9
- I. J. Chin, Nanomaterials (Daeyoungsa, Seoul, 2005) p. 502-506.
- D. Dean, A. M. Obore, S. Richmond, and E. Nyairo, Compos. Sci. Technol., 66, 2135 (2006). https://doi.org/10.1016/j.compscitech.2005.12.015
- T. Lan and T. J. Pinnavaia, Chem. Mater., 6, 2216 (1994). https://doi.org/10.1021/cm00048a006
- J. Wang and S. Qin, Mater. Lett., 61, 4222 (2007). https://doi.org/10.1016/j.matlet.2007.01.058
- T. Imai, Y. Hirano, H. Hirai, S. Kojima, and T. Shimizu, Conf. Rec. IEEE ISEI, 379 (2002).
- L. Y. Lin, J. H. Lee, C. E. Hong, G. H. Yoo, and S. G. Advani, Compos. Sci. Technol., 66, 2116 (2006). https://doi.org/10.1016/j.compscitech.2005.12.025
- J. M. Brown, D. Curlss, and R. A. Vaia, Chem. Mater., 12, 3376 (2000). https://doi.org/10.1021/cm000477+