Acknowledgement
Supported by : 교육과학기술부
References
- M. Gratzel, Nature 414, 338 (2001). https://doi.org/10.1038/35104607
- B. O'Regan and M. Gratzel, Nature 353, 737 (1991). https://doi.org/10.1038/353737a0
- Q. Wang, S. Ito, M. Gratzel, F. Fabregat-Santiago, I. Mora-Sero, J. Bisquert, T. Bessho, and H. Imai, J. Phys. Chem. B 110, 25210 (2006). https://doi.org/10.1021/jp064256o
- M. Gratzel, Inorg. Chem. 44, 6841 (2005). https://doi.org/10.1021/ic0508371
- M. K. Nazeeruddin, A. Kay, I. Rodicio, R. Humphry-Baker, E. Mueller, P. Liska, N. Vlachopoulos, and M. Gratzel, J. Am. Chem. Soc. 115, 6382 (1993). https://doi.org/10.1021/ja00067a063
- Y. H. Luo, D. M. Li, and Q. B. Meng, Adv. Mater. 21, 4647 (2009). https://doi.org/10.1002/adma.200901078
- R. Jose, V. Thavasi, and S. Ramakrishna, J. Am. Ceram. Soc. 92, 289 (2009). https://doi.org/10.1111/j.1551-2916.2008.02870.x
- H. Bonnemann, G. Khelashvili, S. Behrens, A. Hinsch, K. Skupien, and E. Dinjus, J. Cluster Science, 18, 141 (2007). https://doi.org/10.1007/s10876-006-0092-7
- N. Papageorgiou, W. F. Maier, and M. Gratzel, J. Electrochem. Soc. 144, 876 (1997). https://doi.org/10.1149/1.1837502
- E.Olsen, G.Hagen, and S.E.Lindquist, Sol. Energ. Mater. Sol. C, 63, 267 (2000). https://doi.org/10.1016/S0927-0248(00)00033-7
- A. Kay and M. Gratzel, Sol. Energ. Mater. Sol. C. 44, 99 (1996). https://doi.org/10.1016/0927-0248(96)00063-3
- C. H. Tsai, S. Y. Hsu, C. Y. Lu, Y. T. Tsai, T. W. Huang, Y. F. Chen, Y. H. Jhang, and C. C. Wu, Organic Electronics, 2011.
- A. J. Hartmann, M. Neilson, R. N. Lamb, K. Watanabe, and J. F. Scott, Appl. Phys. A 70, 239 (2000). https://doi.org/10.1007/s003390050041
- N. Bedford, C. Dablemont, G. Viau, P. Chupas, and V. Petkov, J. Phys. Chem. C 111, 18214 (2007). https://doi.org/10.1021/jp0752062
- A. Salomonsson, R. M. Petoral, K. Uvdal, C. Aulin, P. Kall, L. Ojamae, M. Strand, M. Sanati, and A. L. Spetz, J. Nanopart. Res. 8, 899 (2006). https://doi.org/10.1007/s11051-005-9058-1
- S. F. Yin, B. Q. Xu, S. J. Wang, and C. T. Au, Appl. Catal. A 301, 202 (2006). https://doi.org/10.1016/j.apcata.2005.12.005
- T. K. Eom, W. Sari, K. J. Choi, W. C. Shin, J. H. Kim, D. J. Lee, K. B. Kim, H. Sohn, and S. H. Kim, Electrochem. Solid State Lett. 12, D85 (2009). https://doi.org/10.1149/1.3207867
- K. Lahtinen, P. Maydannik, P. Johansson, T. Kaariainena, D. C. Camerona, and J. Kuusipalo, Surf. Coating Tech. 205, 3916 (2011). https://doi.org/10.1016/j.surfcoat.2011.02.009
- P. Johansson, K. Lahtinen, J. Kuusipalo, T. Kaariainen, P. Maydannik, and D. Cameron, Atomic Layer Deposition Process for Barrier Applications of Flexible Packaging, Tappi 2010 PLACE Conference, TAPPI (2010).
- H. M. Kwon, D. W. Han, D. J. Kwak, and Y. M. Sung, Appl. Phys. 10, 172 (2010).
- Y. Kashiwa, Y. Yoshida, and S. Hayase, APL. 1, (2008).
- F. Z. Dahou, L. Cattin, J. Garnier, J. Ouerfelli, M. Morsli, G. Louarn, A. Bouteville, A. Khellil, and J. C. Bernede, Thin Solid Films. 518, 6117 (2010). https://doi.org/10.1016/j.tsf.2010.06.009
- K. Suzuki, M. Yamaguchi, M. Kumagai, and S. Yanagida, Chem. Lett. 32, 28 (2003) https://doi.org/10.1246/cl.2003.28
- B. Fan, X. Mei, K. Sun, and J. Ouyang, Appl, Phys, Lett. 93, 143103 (2008). https://doi.org/10.1063/1.2996270
- T. N. Murakami, S. Ito, Q. Wang, Md. K. Nazeeruddin, T. Bessho, I. Cesar, P. Liska, R. H. Baker, P. Comte, P. Pechy, and M. Gratzel, J. Electrochem. Soc. 153, A2255 (2006). https://doi.org/10.1149/1.2358087
- X. Wang, L. Zhi, and K. Mullen, Nano Lett. 8, 323 (2008). https://doi.org/10.1021/nl072838r
- H. Choia, H. Kima, S. Hwanga, W. Choib, and M. Jeon, Sol. Energ. Mater. Sol. C. 95, 323 (2011) https://doi.org/10.1016/j.solmat.2010.04.044
- Y. H. Kim, H. W. Ryu, Y. R. Cho, and W. S. Sub, J. Kor. Inst. Met. & Mater. 44, 838 (2006).