Laser Solutions (한국레이저가공학회지)
- Volume 15 Issue 3
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- Pages.7-10
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- 2012
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- 1229-0963(pISSN)
Characteristics of direct laser micromachining of IC substrates using a nanosecond UV laser
나노초 UV 레이저 응용 IC 기판 소재 조성별 가공 특성
- Sohn, Hyon-Kee (Dept. of High-density & High-energy Beam Processing, KIMM) ;
- Shin, Dong-Sig (Dept. of High-density & High-energy Beam Processing, KIMM) ;
- Choi, Ji-Yeon (Dept. of High-density & High-energy Beam Processing, KIMM)
- Received : 2012.09.14
- Accepted : 2011.03.20
- Published : 2012.09.30
Abstract
Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as