The Transactions of The Korean Institute of Electrical Engineers (전기학회논문지)

The Korean Institute of Electrical Engineers (대한전기학회)
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A Study on Properties of Thermal Insulation Board Prepared by Porous Silica Aerogel

다공성 실리카 에어로겔을 이용한 복합단열재의 특성에 관한 연구

  • Received : 2012.05.16
  • Accepted : 2012.08.20
  • Published : 2012.09.01
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Abstract

High porous silica aerogel/polyurethane polymer composite was manufactured by cross-linking polymerization of polyurethane foaming process. The properties of microstructure, mechanical strength, and thermal properties were investigated for its various applications. The superhydrophobic silica aerogel powders were used for highly thermal insulation filler materials. The thermal conductivities can be resulted 0.07 W/mK to 0.13 W/mK, by decreasing the contents of silica aerogels in composite materials. It is found that the polymerization formulation by organic binders can be applied to heavy industires, building materials, and various industries.

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References

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