Acknowledgement
Supported by : 지식경제부
References
- B. R. Kim, H. K. Lee, S. H. Park, and H. K. Kim, Thin Solid Films, 519, 3492 (2011). https://doi.org/10.1016/j.tsf.2011.01.093
- A. A. Al-Ghamdi and F. E. Tantawy, Compos. Part A : Appl. Sci. Manuf., 41, 1693 (2010). https://doi.org/10.1016/j.compositesa.2010.08.006
- C. S. Chen, W. R. Chen, S. C. Chen, and R. D. Chien, Int.Commun. Heat. Mass., 35, 744 (2008). https://doi.org/10.1016/j.icheatmasstransfer.2008.02.006
- H. B. Shim, M. K. Seo, and S. J. Park, Polymer(Korea), 24, 860 (2000).
- Y. Y. Kim, J. Yun, Y. S. Lee, and H. I. Kim, Carbon Lett., 12, 48 (2011). https://doi.org/10.5714/CL.2011.12.1.048
- B. O. Lee, W. J. Woo, H. S. Song, H. S. Park, H. S. Hahm, J. P. Wu, and M. S. Kim, J. Ind. Eng. Chem., 7, 305 (2011).
- Y. Y. Kim, J. Yun, H. I. Kim, and Y. S. Lee, J. Ind. Eng. Chem., 18, 392 (2012). https://doi.org/10.1016/j.jiec.2011.11.103
- G. Y. Han, O. H. Song, and D. G. Ahn, J. KSPE, 27, 71 (2010).
- Y. H. Chen, C. Y. Huang, F. D. Lai, M. L. Roan, K. N. Chen, and J. T. Yeh, Thin Solid Films, 517, 4984 (2009). https://doi.org/10.1016/j.tsf.2009.03.137
- R. B. Schulz, V. C. Plantz, and D. R. Brush, IEEE Trans. Electromagn. Compat., 30, 362 (1988).
- C. Y. Huang and J. F. Pai, Eur. Polym. J., 34, 261 (1998). https://doi.org/10.1016/S0014-3057(96)00248-0
- R. B. Schulz, V. C. Plantz, and D. R. Brush, IEEE Trans. Electromagn. Compat., 30, 187 (1988). https://doi.org/10.1109/15.3297
- Z. P. Wu, M. M. Li, Y. Y. Hu, Y. S. Li, Z. X. Wang, Y. H. Yin, Y. S. Chen, and X. Zhou, Scripta Mater., 64, 809 (2011). https://doi.org/10.1016/j.scriptamat.2011.01.002
- R. E. Haufler, J. Phys. Chem., 94, 8634 (1990). https://doi.org/10.1021/j100387a005
- Q. Liu, D. Zhang, T. Fan, J. Gu, Y. Miyamoto, and Z. Chen, Carbon, 46, 461 (2008). https://doi.org/10.1016/j.carbon.2007.12.010
- Y. Huang, N. Li, Y. Ma, F. Du, F. Li, and X. He, Carbon, 45, 1614 (2007). https://doi.org/10.1016/j.carbon.2007.04.016
- Z. Liu, G. Bai, Y. Huang, Y. Ma, F. Li, and T. Guo, Carbon, 45, 821 (2007). https://doi.org/10.1016/j.carbon.2006.11.020
- S. Bhadra, N. K. Singha, and D. Khastgir, Curr. Appl. Phys., 9, 396 (2009). https://doi.org/10.1016/j.cap.2008.03.009
- J. G. Kim, C. H. Chung, and Y. S. Lee, Appl. Chem.. Eng., 22, 138 (2011).
- S. Chae, B. Cho, B. Hong, B. Lee, and H. Byun, Appl. Chem. Eng., 21, 430 (2010).
- V. Eswaraiah, V. Sankaranarayanan, and S. Ramaprabhu, Macromol. Mater. Eng., 296, 894 (2011). https://doi.org/10.1002/mame.201100035
- K. S. Kim and S. J. Park, Carbon Lett., 13, 51 (2012). https://doi.org/10.5714/CL.2012.13.1.051
- D. D. L. Chung, Carbon, 39, 279 (2001). https://doi.org/10.1016/S0008-6223(00)00184-6
- X. Shui and D. D. L. Chung, J. Mater. Sci., 35, 1773 (2000). https://doi.org/10.1023/A:1004784720338
- P. Chandrasekhar and K. Naishadham, Synth. Met., 105, 115 (1999). https://doi.org/10.1016/S0379-6779(99)00085-5
- S. J. Park and M. K. Seo, Interface Science and Composites, Elsevier, New York, 2011.
- C. S. Ha and S. C. Kim, J. Appl. Polym. Sci., 35, 2211 (1988). https://doi.org/10.1002/app.1988.070350821
- M. K. Seo, J. R. Lee, and S. J. Park, Mater. Sci. Eng. A, 404, 79 (2005). https://doi.org/10.1016/j.msea.2005.05.065
- S. Hazra and A. Ghosh, J. Phys. Condens. Matter., 9, 3981 (1997). https://doi.org/10.1088/0953-8984/9/19/017
- C. J. Kim, H. D. Choi, K. S. Suh, and H. G. Yoon, Polymer (Korea), 27, 201 (2003).
- H. L. Ewalds and R. J. H. Wanhill, Fracture Mechanics, Edward Anold, London, 1991.
- J. H. Ko, J. C. Kim, and J. H. Chang, Polymer(Korea), 33, 333 (2009).
- H. C. Kim, S. Jeon, H. I. Kim, H. S. Choi, M. H. Hong, and K. S. Choi, Polymer(Korea), 35, 563 (2011).
- J. S. Yang, D. H. Shin, K. Y. Lee, and D. H. Park, Trans. KIEE, 56, 571 (2007).
Cited by
- Characterization of FeCo Magnetic Metal Hollow Fiber/EPDM Composites for Electromagnetic Interference Shielding vol.28, pp.6, 2015, https://doi.org/10.7234/composres.2015.28.6.333
- Influence of MWCNTs on Fracture Toughness of MWCNTs/Nickel-Pitch Fiber/Epoxy Composites vol.28, pp.6, 2012, https://doi.org/10.7234/composres.2015.28.6.361