Journal of the Korea Institute of Information and Communication Engineering (한국정보통신학회논문지)

The Korea Institute of Information and Commucation Engineering (한국정보통신학회)
권호 표지
DOI QR코드

DOI QR Code

Cost-effective and High-performance FBAR Duplexer Module with Wafer Level Packaging

웨이퍼 레벨 패키지를 적용한 저가격 고성능 FBAR 듀플렉서 모듈

  • 배현철 (한국전자통신연구원 패키지연구팀) ;
  • 김성찬 (국립한밭대학교 전자.제어공학과)
  • Received : 2012.03.27
  • Accepted : 2012.05.01
  • Published : 2012.05.31
Download PDF
⟨ Previous Next ⟩

Abstract

This paper presents a cost-effective and high-performance film bulk acoustic resonator (FBAR) duplexer module for US-PCS handset applications. The FBAR device uses a glass wafer level packaging process, which is a more cost-effective alternative to the typical silicon capping process. The maximum insertion losses of the FBAR duplexer at the Tx and Rx bands are of 1.9 and 2.4 dB, respectively. The total thickness of the duplexer module is 1.2 mm, including the glass-wafer bonded Tx/Rx FBAR devices, PCB board, and transfer molding material.

본 논문에서는 US-PCS(US-personal communications services)를 위해 사용이 가능한 저가격 고성능 FBAR (film bulk acoustic resonator) 듀플렉서(duplexer) 모듈(module)을 제시하였다. FBAR 소자는 일반적인 실리콘(Si) 기반의 공정보다 가격경쟁력이 우수한 유리(glass) 웨이퍼 기반의 패키지를 개발하여 적용하였다. FBAR 듀플렉서 모듈의 전송단(Tx)과 수신단(Rx)에서 얻어진 최대 삽입손실 특성은 각각 1.9 dB와 2.4 dB이다. 전송단 및 수신단 FBAR 소자와 본딩(bonding)된 유리 기반의 웨이퍼 및 PCB 기판과 몰딩(molding) 물질을 모두 포함하는 FBAR 듀플렉서 모듈의 전체 두께는 1.2 mm이다.

Keywords

References

  1. P. Wilkerson, M. Kranz, A. Przekwas, T. Hudson, "Flip-chip hermetic packaging of RF MEMS," IEEE Micro electro mechanical Systems Conf., pp. 91-94, 2001.
  2. Lih-Tyng Hwang, Li Li, J. Drye, Shun-Meen Kuo, "Performance evaluation of RF MEMS packages," IEEE Electronic Components and Technology Conf., pp. 1032-1036, 2002.
  3. Suk-Jin Ham, Byung-Gil Jeong, Ji-Hyuk Lim, Kyu-Dong Jung, Kae-Dong Baek, Woon-Bae Kim, Chang-Youl Moon, "Characterization and Reliability Verification of Wafer-Level Hermetic Package with Nano-Liter Cavity for RF-MEMS Applications," IEEE Electronic Components and Technology Conf., pp. 1127-1134, 2007
  4. P. Bradley, R. Ruby, J. D. III Larson, Y. Oshmyansky, D. Figueredo, "A film bulk acoustic resonator (FBAR) Duplexer for USPCS handset applications," IEEE MTT-S Int. Microwave Symp. Dig., pp. 367-370, 2001.
  5. R. Ruby, P. Bradley, D. Clark, D. Feld, T. Jamneala, W. Kun, "Acoustic FBAR for filters, duplexers and front end modules," IEEE MTT-S Int. Microwave Symp. Dig., pp. 931-934, 2004
  6. Yun-Kwon Park, Kuang-Woo Nam, Seok-Chool Yun, Byeoung-Ju Ha, Seog-Woo Hong, Chul-Soo Kim, Jea-Shik Shin, In-Sang Song, "Fabrication of monolithic 1-Chip FBAR duplexer for W-CDMA handsets," IEEE Micro electro mechanical Systems Conf., pp. 803-806, 2007.
  7. G. Li, A. A. Tseng, "Low stress packaging of a micromachined accelerometer," IEEE Trans. Electron. Packaging Manufacturing, vol. 24, pp. 18-25, 2001. https://doi.org/10.1109/6104.924788