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A New Broadband Microstrip-to-SIW Transition Using Parallel HMSIW

  • Received : 2012.04.30
  • Accepted : 2012.06.01
  • Published : 2012.06.30

Abstract

In this work, a new microstrip-to-substrate integrated waveguide (SIW) transition using the parallel half-mode substrate integrated waveguide (HMSIW) is proposed. The proposed transition consists of three sections : a microstrip, parallel HMSIWs, and an SIW. By inserting the parallel HMSIWs section between the microstrip section and the SIW section, the proposed transition can improve the return loss characteristics of the near cut-off frequency because the HMSIWs section has a lower cut-off frequency than the SIW section (8.6 GHz). The lower cut-off frequency is achieved through gradual electromagnetic field mode changes for a low reflection. The measured return loss is less than 20 dB in the of 9.1~16.28 GHz freqeuncy range for the back-to-back transition. The measured insertion loss is within 1.6 dB for the back-to-back transition. The proposed transition is expected to play an important role in wideband SIW circuits fed by a microstrip.

Keywords

References

  1. D. Deslandes, K. Wu, "Integrated microstrip and rectangular waveguide in planar form," IEEE Microwave Wireless Compon. Lett., vol. 11, no. 2, pp. 68-70, Feb. 2001. https://doi.org/10.1109/7260.914305
  2. S. Lee, S. Jung, "Ultra-wideband CPW-to-substrate integrated waveguide transition using an elevated- CPW section," IEEE Microwave Wireless Compon. Lett., vol. 18, no. 11, pp. 746-748, Nov. 2008. https://doi.org/10.1109/LMWC.2008.2005230
  3. N. Jain, N. Kinayman, "A novel microstrip mode to waveguide mode transformer and its applications," IEEE MTT-S Int. Microwave Symp. Dig., vol. 2, pp. 623-626, 2001.
  4. T. H. Yang, C. F. Chen, T. Y. Huang, C. L. Wang, and R. B. Wu, "A 60 GHz L TCC transition between microstrip line and substrate integrated waveguide," Proc. APMC, vol. I, pp. 4-7, Dec. 2005
  5. M. Abdolhamidi, A. Enayati, M. Shahabadi, and R. Faraji-Dana, "Wideband single-layer DC-decoupled Substrate Integrated Waveguide (SIW)-to-microstrip transition using an interdigital configuration," Asia- Pacific Microwave Conference, Dec. 2007.
  6. C. -K. Yau, T. -Y. Huang, T. -M. Shen, H. -Y. Chien, and R. -B. Wu, "Design of 30 GHz transition between microstrip line and substrate integrated waveguide," Asia-Pacific Microwave Conference, Dec. 2007.
  7. D. Deslandes, K. Wu, "Integrated transition of coplanar to rectangular waveguides," IEEE MTT-S Int. Microwave Symp. Dig., pp. 619-622, May 2001.
  8. D. Deslandes, K. Wu, "Analysis and design of current probe transition from grounded coplanar to substrate integrated rectangular waveguides," IEEE Trans. Microwave Theory & Tech., vol. 53, pp. 2487- 2494, Aug. 2005. https://doi.org/10.1109/TMTT.2005.852778
  9. N. Smith, R. Abhari, "Dispersion-equalization techniques for substrate integrated waveguide interconnects," IEEE Trans. Microwave Theory Tech., vol. 58, no. 12, pp. 3824-3831, Dec. 2010.
  10. Q. Lai, C. Fumeaux, W. Hong, and R. Vahldieck, "Characterization of the propagation properties of the half-mode substrate integrated waveguide," IEEE Trans. Microwave. Theory Tech., vol. 57, no. 8, pp. 1996-2004, Aug. 2009. https://doi.org/10.1109/TMTT.2009.2025429
  11. Z. -Y Zhang, K. Wu, "Broadband half-mode substrate integrated waveguide (HMSIW) Wilkinson power divider," IEEE MTT-S Int. Microwave Symp. Dig., pp. 879-882, Jun. 2008.
  12. D. Deslandes, "Design equations for tapered microstrip- to-substrate integrated waveguide transitions," IEEE MTT-S Int. Microwave Symp. Dig., pp. 704- 704, May 2010.

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