참고문헌
- Tee, Y., Luan, J., Ng, H. S., Lim, C. K., Pek, E., and Zhong, Z., 2004, "Advanced Experimental and Simulation Techniques for Analysis of Dynamic Responses during Drop Impact," 54th Electronic Components and Technology Conference, pp. 1088-1094.
- Mattila, T. T., Marjamaki, P., and Kivilahti, J. K., 2006, "Reliability of CSP Interconnctions under Mechanical Shock Loading Conditions," IEEE Transaction on Components and Packaging Technologies, Vol. 29, No. 4, pp. 787-795. https://doi.org/10.1109/TCAPT.2006.885948
- Kim, S. K., and Lim, E. M., 2011, "Dynamic Reliability of Board Level by Changing the Design Parameters of Flip Chips," KSMTE, Vol. 20, No. 5, pp. 559-563.
- Kim, S. K., and Kim, J. Y., 2010, "Simulation of Thermal Fatigue Life Prediction of Flip Chip with Lead-free Solder Joints by Variation in Bump Pitch and Underfill," KSMTE, Vol. 19, No. 2, pp. 157-162.
- JEDEC standard, 2003, Board Level Drop Test Method of Components for Handheld Electronic Products, JESD22-B111.
- Kim, S. K., Kim, H. J., Lim, S. Y, Kim, S. Y., Yang, I. Y., and An, E. J., 2010, "Dynamic Reliability Assesment of Solder Balls on the Design Parameters of Flip Chips," KSMTE, Fall Conference, pp. 149-153.
- Kim, S. K., 2011, "Board-Level Drop Analyses having the Flip Chips with Solder balls of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu," KSMTE, Vol. 20, No. 2, pp. 193-201.
- Kim, S. K., Kim, K. L., Bae, J. G., Park, S. H. and Lee, D. G., 2009, "Dynamic Analysis of Flip Chips with Solder Balls with Two Different Compositions," KSPE, Fall Conference, pp. 207-208.
피인용 문헌
- Prediction of Impact Life Time in Solder Balls of the Board Level Flip Chips by Drop Simulations vol.23, pp.3, 2014, https://doi.org/10.7735/ksmte.2014.23.3.237
- Prediction of the Impact Lifetime for Board-Leveled Flip Chips by Changing the Design Parameters of the Solder Balls vol.24, pp.1, 2015, https://doi.org/10.7735/ksmte.2015.24.1.117