반도체 제조 공정에서 발생 가능한 부산물

Exposure Possibility to By-products during the Processes of Semiconductor Manufacture

  • 박승현 (한국산업안전보건공단 산업안전보건연구원) ;
  • 신정아 (한국산업안전보건공단 산업안전보건연구원) ;
  • 박해동 (한국산업안전보건공단 산업안전보건연구원)
  • Park, Seung-Hyun (Occupational Safety and Health Research Institute (OSHRI), Korea Occupational Safety and Health Agency (KOSHA)) ;
  • Shin, Jung-Ah (Occupational Safety and Health Research Institute (OSHRI), Korea Occupational Safety and Health Agency (KOSHA)) ;
  • Park, Hae-Dong (Occupational Safety and Health Research Institute (OSHRI), Korea Occupational Safety and Health Agency (KOSHA))
  • 발행 : 2012.03.31

초록

Objectives: The purpose of this study was to evaluate the exposure possibility of by-products during the semiconductor manufacturing processes. Methods: The authors investigated types of chemicals generated during semiconductor manufacturing processes by the qualitative experiment on generation of by-products at the laboratory and a literature survey. Results: By-products due to decomposition of photoresist by UV-light during the photo-lithography process, ionization of arsine during the ion implant process, and inter-reactions of chemicals used at diffusion and deposition processes can be generated in wafer fabrication line. Volatile organic compounds (VOCs) such as benzene and formaldehyde can be generated during the mold process due to decomposition of epoxy molding compound and mold cleaner in semiconductor chip assembly line. Conclusions: Various types of by-products can be generated during the semiconductor manufacturing processes. Therefore, by-products carcinogen such as benzene, formaldehyde, and arsenic as well as chemical substances used during the semiconductor manufacturing processes should be controlled carefully.

키워드

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