Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
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A Study on the Grinding Characteristics of Porous Ceramics

Porous Ceramics의 연삭특성에 관한 연구

  • 박휘근 (금오공과대학교 대학원 기계설계공학과) ;
  • 박세진 (금오공과대학교 대학원 기계설계공학과) ;
  • 최윤서 (금오공과대학교 대학원 기계설계공학과) ;
  • 황인환 (금오공과대학교 대학원 기계설계공학과) ;
  • 이종찬 (금오공과대학교 기계공학부)
  • Published : 2012.04.30
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Abstract

The resin bonded diamond wheel is used to grind the difficult-to-cut materials. Traditionally, the resin bonded diamond wheel is manufactured without any pores due to the characteristics of resin bond. In this study, two porous resin bonded diamond wheel were made and the grinding characteristics were compared with traditional nonporous ones. The experimental results indicate that the porous resin bond diamond wheel require less grinding forces and powers.

Keywords

References

  1. Tae Jo Ko, et. al., "Modern Machine Tools", Munundang, Chapter 6, pp. 286-288.
  2. Malkin, S. "Grinding Technology(Theory and Applicarions of Machining with Abrasives)" pp. 110-111.
  3. Jong-Chan Lee, et. al., "Grinding & Machining with Superabrasives", Chapter 5, pp. 96-100. 1998
  4. Malkin, S "Size effect for specific energy in grinding of silicon nitride".
  5. Jong-Chan Lee, et. al., "Modern Manufacturing Processes", Munundang, Chapter 9, pp. 425-432.
  6. Sangbaek Ha, "A Study on the Grinding of Structural Ceramics using Diamond Wheels", Kum-Oh National Institute of Technology, 1997.
  7. Choong-Seok Lee, Seung-Su Chae, Se-Jin Park, Joong-Pyo Oh, Jong-Chan Lee, "A Study on the Grinding Characteristics of SiC", Proceedings of the KSMPE Autumn Conference, pp. 245-250, 2006.
  8. Young-Chul Jang, "A Study on the Grinding Characteristics of Silicon Carbide(SiC) using Diamond Wheel", Kum-Oh National Institute of Technology, 2006.
  9. Choong-Seok Lee, Seung-Su Chae, Jong-Pyo Kim, Jong-Chan Lee, Hwan Choi, "A Study on the Grinding Force of Silicon", Journal of the Korean Society of Manufacturing Process Engineers, Vol. 5, No. 1, pp. 33-38, 2006.