Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
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Modification of the Supporting Structure of a Wafer Polishing Machine for the Improved Stability

안정성 향상을 위한 Wafer Polishing Machine의 지지구조 개선

  • 노승훈 (금오공과대학교 지능기계공학과) ;
  • 김영조 (금오공과대학교 대학원) ;
  • 김동욱 (금오공과대학교 대학원) ;
  • 이일환 (금오공과대학교 대학원) ;
  • 박근우 (금오공과대학교 대학원)
  • Published : 2012.04.30
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Abstract

Polishing is not only one of the most frequently adopted processes in modern industries, but also the most critical one to the surface quality of the products such as semi conductor wafers and LED sapphire wafers. With the required specifications for the wafer surface quality getting more and more strengthened, the manufacturers are spending huge amount of cost to renew the machine to meet the enhanced surface specifications. Surface qualities of the wafers are mostly damaged by the structural vibrations of the polishing machines. In this paper, the dynamic characteristics of a wafer polishing machine have been analyzed through the frequency response test and the computer simulation. And the supporting structure of a polishing machine has been investigated to minimize the vibration transmissions, to improve the stability of the machine and further to reduce the defects of the polished products. The result of the study shows that simple design modifications of the supporting structure without altering the main structure of the machine can substantially suppress the vibrations of the machine with negligible expenses.

Keywords

References

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