마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)

  • 제19권1호
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  • Pages.9-16
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  • 2012
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  • 1226-9360(pISSN)
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  • 2287-7525(eISSN)
한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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고방열 절연시트의 기술개발 동향

Review of Technology Development of High Heat Dissipative Insulating Sheet

  • 투고 : 2012.02.29
  • 심사 : 2012.03.09
  • 발행 : 2012.03.31
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초록

Currently due to increasing integration of various electronic devices and need of multi-functions, more and more heat is produced and for electronic devices to achieve maximum performance with optimum life time, heat dissipation is critical. A solution to such problems is use of high heat dissipative insulating sheet. In this paper status of current products are introduced and several technology aspects to meet the demand of increased heat dissipation needs is introduced.

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참고문헌

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