Journal of the Korean Wood Science and Technology

The Korean Society of Wood Science & Technology (한국목재공학회)
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Effect of Temperature and Bake-out on Formaldehyde Emission from UF Bonded Wood Composites

  • Lee, Young-Kyu (Indoor Air Quality Analysis Center, National Instrumentation Center for Environmental Management, Seoul National University) ;
  • Kim, Hyun-Joong (Laboratory of Adhesion and Bio-Composites, Program in Environmental Materials Science, Seoul National University)
  • Received : 2012.01.30
  • Accepted : 2012.03.20
  • Published : 2012.03.25
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Abstract

This study analysis the effect of various temperatures (20, 35 and $50^{\circ}C$) on the formaldehyde emission from wood composites, which were particleboard (PB), medium density fiberboard (MDF), high density fiberboard (HDF) and laminated HDF (L-HDF) by Japanese desiccator method. Also, to reduce formaldehyde emission by wood composites, it has been suggested that undergo a bake-out conditions. On average, the level of formaldehyde emission increased many times with a $15^{\circ}C$ increase in temperature from 20 to $35^{\circ}C$ for PB, MDF, HDF and L-HDF, respectively. Formaldehyde emissions from wood composites could be expected to increase with increasing ambient temperature. At $35$ for 28 days bake-out treatment of boards, the free formaldehyde emission reduced 67.8% (PB), 40.1% (MDF), 37.8% (HDF), and 35.2% (L-HDF). On the other hand, after the bake-out at $50^{\circ}C$ for 28 days, the formaldehyde concentration decreased by 88.2, 66.9, 62.2 and 59.3% of the concentration before the bake-out for PB, MDF, HDF and L-HDF, respectively. An interesting of the bake-out treatment at $50^{\circ}C$ after 14 days, formaldehyde emission grade of PB & MDF down $E_2$ to $E_1$, and HDF & L-HDF down $E_1$ to $E_0$.

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References

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