Journal of the Korean Society of Industry Convergence (한국산업융합학회 논문집)
- Volume 15 Issue 2
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- Pages.55-58
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- 2012
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- 1226-833X(pISSN)
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- 2765-5415(eISSN)
DOI QR Code
Study on the Structural Analysis of Chip Bonding Machine Base
Chip Bonding Machine Base 구조해석에 관한 연구
- Kim, Won-Jong (Department of Engineering Science & Mechanics, Graduate School, KIT) ;
- Hwang, Eun-Ha (Department of Mechanical Design Engineering, KIT, KAIST)
- Received : 2012.04.12
- Accepted : 2012.05.25
- Published : 2012.05.31
Abstract
This study is concerned about the design and structural analysis of high integrated Chip Bonding Machine. Recently, many studies have been undergoing to reduce a working time in a field of Chip Bonding Machine. Chip Bonding Machine belongs to reduce a stand-by time by Chip Moving time. The developed system can save tool moving distance in small space than other machine. The analysis is carried out by SoldEdge & Ansys software.