Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Study on the Formation Mechanism of Electroless Plating Seeds on Polymer by Laser

레이저에 의한 폴리머상의 무전해 도금 시드 형성 메커니즘 연구

  • Paik, Byoung-Man (Department of Laser & Electron Beam Application, KIMM) ;
  • Lee, Jae Hoon (Department of Laser & Electron Beam Application, KIMM) ;
  • Shin, Dong-Sig (Department of Laser & Electron Beam Application, KIMM) ;
  • Lee, Kun-Sang (School of Mechanical Engineering, Kookmin Univ.)
  • 백병만 (한국기계연구원 광응용기계연구실) ;
  • 이제훈 (한국기계연구원 광응용기계연구실) ;
  • 신동식 (한국기계연구원 광응용기계연구실) ;
  • 이건상 (국민대학교 기계시스템공학부)
  • Received : 2011.05.02
  • Accepted : 2011.09.22
  • Published : 2012.01.01
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Abstract

The LDS(Laser Direct Structuring) is one of the new direct writing methods to fabricate conductive patterns by energy beam. It uses thermoplastic polymers with an additive compound that serves as plating seed after the activation by laser. The advantages of LDS include the miniaturization of electrical components, design flexibility, and a reduced number of production steps. The purpose of this study is to investigate the fundamental mechanism for LDS and the characteristics of conductive patterns by laser parameters. These results were studied by SEM, EDX, and XPS analysis. We have used a 20W pulse-modulated fiber laser and copper electroless plating to fabricate conductive patterns on polymer. The result showed that electroless copper plating seed caused the laser cracking of additive compound. In particular, the additive compound contained in copper metal oxides atoms will be changed to copper metal elements. Also, the characteristics of conductive patterns were dependent on laser parameter, especially laser fluence.

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