References
- J. H. Sinsky, M. Duelk and A. Adamiecki, "High-Speed Electrical Backplane Transmission Using Duobinary Signaling", IEEE Trans. Microw. Theory Tech., 53(1), 152 (2005). https://doi.org/10.1109/TMTT.2004.839326
- W. J. Dally and J. Poulton, "Transmitter Equalization for 4- Gbps Signaling", IEEE Micro, 17(1), 48 (1997). https://doi.org/10.1109/40.566199
- J. H. Ryu, D. M. Kim, E. S. Kim and M. Y. Jeong, "Optical PCB and Packaging Technology", J. Microelectron. Packag. Soc., 18(1), 7 (2011).
- J. T. Kim, K. B. Yoon and C. G. Choi, "Passive Alignment Method of Polymer PLC Devices by Using a Hot Embossing Technique", IEEE Photon. Technol. Lett., 16, 1664 (2004). https://doi.org/10.1109/LPT.2004.828355
- A. Hashim, N. Bamiedakis, J. Beals IV, Y. Hao, R. V. Penty and I. H. White, "Polymer-Based Board-Level Optical Interconnects", Proc. IEEE 2nd International Conference on Photonics (ICP), Kota Kinabalu, 1, IEEE Photonics Society (2011).
- S. Bernabe, C. Kopp, M. Volpert, J. Harduin, J. Fedeli and H. Ribot, "Chip-to-Chip Optical Interconnections between Stacked Self-Aligned SOI Photonic Chips", Opt. Express, 20(7), 7886 (2012). https://doi.org/10.1364/OE.20.007886
- S. H. Hwang, M. H. Cho, S. K. Kang, T. W. Lee, H. H. Park and B. S. Rho, "Two-Dimensional Optical Interconnection Based on Two-Layered Optical Printed Circuit Board", IEEE Photon. Technol. Lett., 19(6), 411 (2007). https://doi.org/10.1109/LPT.2007.892888
- W. J. Lee, S. H. Hwang, M. J. Kim, E. J. Jung, J. B. An, G. W. Kim, M. Y. Jeong and B. S. Rho, "Surface Input/Output Optical Splitter Film for Multilayer Optical Circuits", IEEE Photo. Technol. Lett., 24(6), 506 (2012). https://doi.org/10.1109/LPT.2011.2182641
- R. C. A. Pitwon, K. Wang, J. G. Jones, I. Papakonstantinou, H. Baghsiahi, B. J. Offrein, R. Dangel, D. Milward and D. R. Selviah, "FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers", J. Lightw. Technol., 30(21), 3316 (2012). https://doi.org/10.1109/JLT.2012.2214764
- I. K. Cho, J. H. Ryu and M. Y. Jeong, "Interchip Link System Using an Optical Wiring Method", Opt. Lett., 33(16), 1881 (2008). https://doi.org/10.1364/OL.33.001881
- J. H. Ryu, P. J. Kim, C. S. Cho, E. H. Lee, C. S. Kim and M. Y. Jeong, "Optical Interconnection for a Polymeric PLC Device Using Simple Positional Alignment", Opt. Express, 19(9), 8571 (2011). https://doi.org/10.1364/OE.19.008571
- Y. S. Kim, S. U. Cho, H. J. Kang and M. Y. Jeong, "A Study on the Imprinting Process for an Optical Interconnection of PLC Device", J. KSPE, 29(12), 1376 (2012). https://doi.org/10.7736/KSPE.2012.29.12.1376
- D. M. Kim, T. K. Lee, T. H. Lee and M. Y. Jeong, "Design for High-Efficient Passive Optical PCB Interconnection by Using Built-In Lens Structure", J. Microelectron. Packag. Soc., 19(2), 47 (2012). https://doi.org/10.6117/kmeps.2012.19.2.047
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