Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Optical Packaging and Interconnection Technology

광 패키징 및 인터커넥션 기술

  • 김동민 (부산대학교 차세대전자기판회로학과) ;
  • 류진화 (한국전자통신연구원) ;
  • 정명영 (부산대학교 WCU 인지메카트로닉스공학과)
  • Received : 2012.12.03
  • Accepted : 2012.12.26
  • Published : 2012.12.30
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Abstract

By the need for high-speed data transmission in PCB, the studies on the optical PCB has been conducted with optical interconnection and its packaging technology. Particularly, the polymer-based optical interconnection has been extensively studied with the advantages such as cost-effective and ease of process. For high-efficiency and passive alignment, the studies were performed using the 45 degree mirrors, MT connector, and etc. In this work, integrated PLC device and fiber alignment array block was fabricated by using imprint technology to solve the alignment and array problem of optical device and the optical fiber. The fabricated integrated block for optical interconnection of PLC device has achieved higher precision of decreasing the dimensional error of the patterns by optimization of process and its insertion loss has an average value of 4.03dB, lower than criteria specified by international standard. In addition, a optical waveguide with built-in lens has been proposed for high-efficiency and passive alignment. By simulation, it was confirmed that the proposed structure has higher coupling efficiency than conventional no-lens structure and has the broad tolerance for the spatial offset of optical waveguide.

Keywords

References

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