DOI QR코드

DOI QR Code

Sn Whisker Research Trend in Japan

Sn 휘스커 연구동향

  • 김근수 (호서대학교 융합기술연구소)
  • Received : 2012.12.12
  • Accepted : 2012.12.17
  • Published : 2012.12.30

Abstract

Sn whiskers are a serious cause of failure in electronic devices as they create short circuits. Sn whisker growth and mitigation have been investigated by many Japanese consortia including JEITA and JAXA. This paper gives an overview about recent researches of JEITA and JAXA.

Keywords

References

  1. The RoHS Regulation (Directive 2002/95/EC) from http:// www.rohs-guide.com
  2. J. Bath, C. Handweker and E. Bradley, "Research Update: Lead Free Solder Alternative", Circuit Assembly, 11(5), 30 (2000).
  3. Japan Electronics and Information Technology Industries Association, "Guideline for Selection of Lead-Free Materials for Tin-Whisker Mitigation" (In Japanese) (2010).
  4. Benchmarking and Best Practices Center of Excellence, "Pbfree Electronics Research Manhattan Project", ACI Technologies Inc. (2009).
  5. K. Suganuma, "すずウィスカ発生のメカニズムと対策の珼状" (In Japanese), Uyemura Technical Reports, 62, 3 (2007).
  6. H. Leidecker, "Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin Whisker and Discussion of Investigative Techniques Used for Whisker Detection", Proc. 5th International Symposium on Tin Whisker, Maryland, 14, University of Maryland (2011).
  7. A. Telang and T. Bieler, "Characterization of Microstructure and Crystal Orientation of the Tin Phase in Single Shear Lap Sn?3.5Ag Solder Joint Specimens", Scr. Mater., 52(10), 1027 (2005). https://doi.org/10.1016/j.scriptamat.2005.01.043
  8. J. Rayne and B. Chandrasekhar, "Elastic Constants of ${\beta}$ Tin from $4.2^{\circ}K$ to $300^{\circ}K$", Phys. Rev., 120(5), 1658 (1960). https://doi.org/10.1103/PhysRev.120.1658
  9. H. Huntington, "The Elastic Constants of Crystals", Solid state phys., 7, 213 (1958). https://doi.org/10.1016/S0081-1947(08)60553-6
  10. D. House and E. Vernon, "Determination of the Elastic Moduli of Tin Single Crystals, and Their Variation with Temperature", British J. Appl. Phys., 11(6), 254 (1960). https://doi.org/10.1088/0508-3443/11/6/308
  11. J. W. Osenbach, R. L. Shook, B. T. Vaccaro, B. D. Potteiger, A. N. Amin, K. N. Hooghan, P. Suratkar and P. Ruendsinsub, "Sn Whiskers: Material, Design, Processing, and Post-plate Reflow Effects and Development of an Overall Phenomenological Theory", IEEE Trans. Electron. Pack. Manuf., 28(1), 36 (2005). https://doi.org/10.1109/TEPM.2005.847438
  12. W. J. Boettinger, C. E. Johnson, L. A. Bendersky, K. -W. Moon, M. E. Williams and G. R. Stafford, "Whisker and Hillock Formation on Sn, Sn?Cu and Sn?Pb Electrodeposits", Acta Mater., 53(19), 5033 (2005). https://doi.org/10.1016/j.actamat.2005.07.016
  13. K. N. Tu and J. C. M. Li, "Spontaneous Whisker Growth on Lead-Free Solder Finishes", Mater. Sci. Eng. A, 409(1-2), 131 (2005). https://doi.org/10.1016/j.msea.2005.06.074
  14. A. Baated, K. Hamasaki, S. S. Kim, K. ?S Kim and K. Suganuma, "Whisker Growth Behavior of Sn and Sn Alloy Lead- Free Finishes", J. Electron. Mater., 40(11), 2278 (2011). https://doi.org/10.1007/s11664-011-1712-z
  15. A. Baated, K. S. Kim and K. Suganuma, "Effect of Intermetallic Growth Rate on Spontaneous Whisker Growth from a Tin Coating on Copper", J. Mater. Sci: Mater. Electron., 22, 1685 (2011). https://doi.org/10.1007/s10854-011-0346-5
  16. K. S. Kim, "Effects of Heat Treatment on the Microstructure and Whisker Growth Propensity of Matte Tin Finish", J. Microelectron. Packag. Soc., 17(2), 11 (2010).
  17. K. S. Kim, Y. M. Leem and C. H. Yu, "Structure and Growth of Tin Whisker on Leadframe with Lead-Free Solder Finish", J. Microelectron. Packag. Soc., 11(3), 1 (2004).
  18. C. Oh, J. S. Jung, K. -Y. Ku, Y. -H. Yoon, U. H. Hwang and W. S. Hong, "The Growth Mechanism and Mitigation Method of Sn Whiskers", J. KWJS, 29(4), 3 (2011). https://doi.org/10.5781/KWJS.2011.29.4.365
  19. N. Nemoto and T. Nakagawa, "宇宙分野におけるソルダリング技術の取り組み" (In Japanese), 日本溶接學會 第46回 マイクロ接合硏究委員會 (2008).
  20. Japan Aerospace Exploration Agency, JAXA Special Publication (In Japanese) (2008) from http://airex.tksc.jaxa.jp/dr/ prc/japan/contents/AA0064022000/64022000.pdf
  21. N. Nemoto, "Tin Whisker Evaluation Status for Space Application", Proc. 4th International Symposium on Tin Whisker, Maryland, 23, University of Maryland (2010).
  22. K. Suganuma, A. Baated, K. -S. Kim, K. Hamasaki, N. Nemoto, T. Nakagawa and T. Yamada, "Sn Whisker Growth during Thermal Cycling", Acta Mater., 59(19), 7255 (2011). https://doi.org/10.1016/j.actamat.2011.08.017
  23. Government Electronics and Information Technology Association, "Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts" (2008).

Cited by

  1. Mitigation Methods of Sn Whisker Growth on Pure Sn Plating vol.31, pp.3, 2013, https://doi.org/10.5781/KWJS.2013.31.3.21