Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Current Limiting and Voltage Sag Compensation Characteristics of Flux-Lock Type SFCL Using a Transformer Winding

변압기 권선을 이용한 자속구속형 초전도 전류제한기의 전류제한 및 전압강하 보상 특성

  • Ko, Seok-Cheol (Industry-University Cooperation Foundation, Kongju National University)
  • Received : 2012.10.15
  • Accepted : 2012.11.19
  • Published : 2012.12.01
Download PDF
⟨ Previous Next ⟩

Abstract

The superconducting fault current limiter (SFCL) can quickly limit the fault current shortly after the short circuit occurs and recover the superconducting state after the fault removes and plays a role in compensating the voltage sag of the sound feeder adjacent to the fault feeder as well as the fault current limiting operation of the fault feeder. Especially, the flux-lock type SFCL with an isolated transformer, which consists of two parallel connected coils on an iron core and the isolated transformer connected in series with one of two coils, has different voltage sag compensating and current limiting characteristics due to the winding direction and the inductance ratio of two coils. The current limiting and the voltage sag compensating characteristics of a SFCL using a transformer winding were analyzed. Through the analysis on the short-circuit tests results considering the winding direction of two coils, the SFCL designed with the additive polarity winding has shown the higher limited fault current than the SFCL designed with the subtractive polarity winding. It could be confirmed that the higher fault current limitation of the SFCL could be contributed to the higher load voltage sag compensation.

Keywords

References

  1. B. W. Lee, J. S. Kang, K. B. Park, and I. S. Oh, Superconductivity and Cryogenics, 5, 10 (2003).
  2. H. Kado and M. Ichikawa, M. Shibuya, M. Kojima, M. Kawahara, and T. Matsumura, IEEE Trans. Appl. Supercond., 15, 2051 (2005). https://doi.org/10.1109/TASC.2005.849449
  3. H. Shimizu, Y. Yokomizu, T. Matsumura, and N. Murayama, IEEE Trans. Appl. Supercond., 12, 876 (2002). https://doi.org/10.1109/TASC.2002.1018540
  4. H. Shimizu, Y. Yokomizu, and T. Matsumura, IEEE Trans. Appl. Supercond., 14, 807 (2004). https://doi.org/10.1109/TASC.2004.830279
  5. S. H. Lim, T. H. Han, S. W. Yim, H. S. Choi, and B. S. Han, IEEE Trans. Appl. Supercond., 17, 1827 (2007). https://doi.org/10.1109/TASC.2007.899868
  6. S. H. Lim, Physica, C468, 2076 (2008).
  7. H. S. Choi and S. H. Lim, IEEE Trans. Appl. Supercond., 17, 1823 (2007). https://doi.org/10.1109/TASC.2007.898482
  8. S. H. Lim, J. F. Moon, and J. C Kim, IEEE Trans. Appl. Supercond., 19, 1900 (2009). https://doi.org/10.1109/TASC.2009.2017710
  9. S. H. Lim and H. S. Choi, Physica, C445, 1073 (2006).
  10. S. H. Lim, J. Electr. Eng. Technol., 2, 289 (2007). https://doi.org/10.5370/JEET.2007.2.3.289
  11. T. H. Han and S. H. Lim, J. KIEEME, 24, 136 (2011).