한국산학기술학회논문지 (Journal of the Korea Academia-Industrial cooperation Society)

  • 제12권9호
  • /
  • Pages.4138-4146
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  • 2011
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  • 1975-4701(pISSN)
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  • 2288-4688(eISSN)
한국산학기술학회 (The Korea Academia-Industrial cooperation Society)
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Fiber sensor를 이용한 미소칩 미삽 방지 표면실장기술

The surface mounting technology to prevent improper fine chip insertions by using fiber sensors

  • 김영민 (공주대학교 멀티미디어공학과) ;
  • 김현종 (공주대학교 컴퓨터공학과) ;
  • 엄순천 (공주대학교 컴퓨터공학과) ;
  • 공헌택 (공주대학교 컴퓨터공학과) ;
  • 김치수 (공주대학교 컴퓨터공학과)
  • Kim, Young-Min (Dept. of Multimedia Engineering, Kongju National University) ;
  • Kim, Hyun-Jong (Dept. of Computer Engineering, Kongju National University) ;
  • Um, Sun-Chon (Dept. of Computer Engineering, Kongju National University) ;
  • Kong, Heon-Tag (Dept. of Computer Engineering, Kongju National University) ;
  • Kim, Chi-Su (Dept. of Computer Engineering, Kongju National University)
  • 투고 : 2011.08.23
  • 심사 : 2011.09.08
  • 발행 : 2011.09.30
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초록

표면실장기술(SMT: Surface Mount Technology)에 있어서 휴대폰 및 평판 디스플레이가 점점 가볍고 얇아지면서 이 제품에 사용되는 전자부품이 작아지고 있어, 0402, 0603 Chip등과 같은 SMD(Surface Mount Device) 부품을 실장하는 기술이 대두되고 있다. 따라서 Chip Mounter 제조회사들은 미삽이나 오삽을 방지하기 위한 실장기술에 대해 지속적인 연구를 해오고 있다. 본 연구는 이러한 미삽 오삽 방지를 실현하기 위하여 Fiber sensor를 이용하여 기계적 구조를 마련하고, 이를 활용한 시스템 알고리즘을 개선하는 기술을 제시한다.

In surface mount technology, with cellular phones and flat panel displays shrinking in size, the electric goods for making these things are getting smaller as well. Therefore, the technology of mounting components such as 0402 and 0603 Chip is on the rise. The chip mount manufacturing companies have studied the mount technology to prevent the missing insertions or improper insertion. This study suggests arranging the mechanical structure by using fiber sensors to eliminate missing insertions or improper insertions and developing the technology for upgrading system algorithms.

키워드

참고문헌

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