References
- Failure Mechanisms and Models for Semiconductor Devices, in JEDEC publication JEP122C, 2006.
- I. A. Belch and J. Sello, "The Failure of Thin Aluminum Current-Carrying Strips on Oxidized Silicon," Physics of Failure in Electronics, vol. 5, pp. 496-505, 1966.
- James R. Black, "Electromigration - A Brief Survey and Some Recent Results," IEEE Trans. on Electron Devices, vol. ED-16(no. 4), pp. 338, 1969.
- K. Banerjee and A. Mehrotra, "Global Interconnect Warming," IEEE Circuits and Devices Magazine, pp. 16-32, 2001.
- A. R. Oriani, "Thermomigration in Solid Metals," Journal of Physics and Chemistry of Solids, pp. 339-351, 1969.
- N. S. Nagaraj, F. Cano, H. Haznedar and D. Young, "A Practical Approach to Static Signal Electromigration Analysis," in Proc. ACM/IEEE Design Automation Conference, pp. 572-577, 1998.
- D. Blaauw, C. Oh, V. Zolotov and A. Dasgupta, "Static Electromigration Analysis for On-Chip Signal Electromigration Analysis," IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol. 22, pp. 39-48, 2003. https://doi.org/10.1109/TCAD.2002.805728
- J. E. Hall, D. E. Hocevar, P. Yang and M. J. McGraw, "SPIDER - A CAD System for Modeling VLSI Metallization Patterns," IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol. 36, pp. 1023-1031, 1978.
- R. H. Tu et al., "Berkeley Reliability Tools - BERT," IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol. 12, pp. 1524-1534, 1993. https://doi.org/10.1109/43.256927
- D. F. Frost and K. F. Poole, "RELIANT: A Reliability Analysis Tool for VLSI Interconnects," IEEE Journal of Solid-State Circuits, vol. 24, pp. 458-462, 1989. https://doi.org/10.1109/4.18608
- C. Teng, Y. Cheng, E. Rosenbaum and S. Kang, "iTEM: A Temperature-Dependent Electromigration Reliability Diagnosis Tool," IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol. 16, pp. 882-893, 1997. https://doi.org/10.1109/43.644613
- K. Agarwal and F. Liu, "Efficient Computation of Current Flow in Signal Wires for Reliability Analysis," in Proc. IEEE/ACM International Conference on Computer-Aided Design, pp. 741-746, 2007.
- M. Celik, L. Pileggi and A. Odabasioglu, IC Interconnect Analysis, Kluwer Academic Publishers, 2002.
- L. T. Pillage and R. A. Rohrer, "Asymptotic Waveform Evaluation for Timing Analysis," IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, vol. 9, pp. 352-366, 1990. https://doi.org/10.1109/43.45867
- L. T. Pillage, R. A. Rohrer and C. Visweswariah, Electronic Circuit and System Simulation Methods, McGraw-Hill, Inc., 1994.
- 김기영, 임재호, 김석윤, "반도체 회로 연결선의 신뢰도 해석을 위한 전류 해석 기법," 대한전기학회 논문지 59권 8호, pp. 1406-1415, Aug. 2010.
- International Technology Roadmap for Semiconductors (ITRS) : Interconnect, 2007.