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진공펌프 조합에 의한 반도체공정 진공시스템 진공특성 전산모사

Simulation of Vacuum Characteristics in Semiconductor Processing Vacuum System by the Combination of Vacuum Pumps

  • 김형택 (인천대학교 신소재공학과) ;
  • 김대연 (인천대학교 신소재공학과)
  • Kim, Hyung-Taek (Department of Advanced Materials Engineering, University of Incheon) ;
  • Kim, Dae-Yeon (Department of Advanced Materials Engineering, University of Incheon)
  • 투고 : 2011.03.24
  • 심사 : 2011.05.16
  • 발행 : 2011.06.01

초록

Effect of pump combinations on the vacuum characteristics of vacuum system was simulated for optimum design of system. In this investigation, the feasibility of modelling mechanism for VacSimMulti simulator was proposed. Simulation results of various pumping combinations showed the possibilities and reliabilities of simulation for the performance of vacuum system in specific semiconductor processing. Simulation of roughing pump presented the expected pumping behaviors based on commercial specifications of employed pumps. Application of booster pump exhibited the high pumping efficiency for middle vacuum range. Combinations of optimum backing pump for diffusion and turbo vacuum system were obtained. And, the predictable characteristics of process application of both simulated systems were also acquired.

키워드

참고문헌

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