DOI QR코드

DOI QR Code

Evaluation on Welding Characteristic of Ni-Cu Sheet by Ultrasonic Machining

초음파 가공에 의한 Ni-Cu 박판의 용착 특성 평가

  • Received : 2010.10.15
  • Accepted : 2011.03.10
  • Published : 2011.03.31

Abstract

This paper is studied on the influence of machining conditions on weldability obtained by ultrasonic machining. The weldability estimation of dissimilar Ni-Cu sheets with the optimization of one-wavelength horn is confirmed by the use of ultrasonic machining. The optimal welding condition with tensile test by setting the ultrasonic machining parameters is suggested and the weldability is estimated by SEM observation and EDX-ray analysis. Experimental studies are worked with the measure of tensile strength and the analysis of SEM photograph after the ultrasonic machining of workpiece. Machining parameters of machining time, pressure, and amplitude are also applied to this paper.

본 논문은 초음파 가공에 의한 용착성을 가공조건의 영향에 관하여 나타내었다. 한파장 혼의 최적화를 이용한 Ni-Cu 이종금속 박판의 용착성 평가는 초음파 가공 방법을 이용하여 확인된다. 초음파 가공변수 설정에 따른 인장시험을 통한 최적의 용착조건을 제시하였으며 SEM 사진과 EDX-ray 분석에 의한 용착성을 평가하였다. 실험적 연구는 초음파 가공 후 인장강도의 측정, SEM사진 분석으로 수행된다. 또한 가공시간, 가압력, 진폭의 가공변수들은 본 연구에 적용되었다.

Keywords

References

  1. Moon, H. H, Park, B. G., Lee, C. H. and Kim, S. C., "A Study on the Surface Roughness of Ceramics According to Ultrasonic Polishing," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 2, No. 1, pp.15∼21, 2003. 3.
  2. Jeong, H. S., "Fundamentals of Ultrasonic Welding," Journal of Korean Welding and Joining Society, Vol. 15, No. 6, pp. 24, 1997.
  3. Koo, J. M., Kim, J. W., Yoon, J. W., Noh, B. I., Lee, C. Y., Moon, J. H., Yoo, C. D. and Jung, S. B., "Ultrasonic Bonding Technology for Flip Chip Packaging,"Journal of the Korean Welding and Joining Society, Vol. 26, No. 1, pp. 24-30, 2008. https://doi.org/10.5781/KWJS.2008.26.1.024
  4. Lee, C. K., Hwang, B. J. and Heu, I. H., "Bonding of Electric Wire by Ultrasonic Welding,"Journal of the Korean Society of Machine Tool Engineers, Vol. 9, No. 4, pp. 41-42, 2000.
  5. Lee, J. H., Kim, S. H., Cheon, C. G., Kim, S. U. and Kim, J. D., "Effects of Welding Parameters on Ultrasonic Bonding Strength of Solar Collector, "Proceedings of the KWS Conference, pp. 233-235, May 2006.
  6. Kim, H. W., Hwang, K. M., Yoo, B. S. and Jo, S. M., "Welding Quality Evaluation by Waveform analysis on Copper Ultrasonic Spot Welding, "Proceedings of the KWS Conference, pp. 297-299, November 2007.
  7. Seo, J. S. and Beck, S. Y., "A Study for Design of Ultrasonic Welding One-wave Horn and Metal Welding,"Journal of Korea Intellectual Patent Society, Vol. 14, No. 4, pp. 17-23, 2009.
  8. Park, H. S., Kim, W. Y. and Kang, C. Y., "Welding and Bonding of Dissimilar Metal Steel/Nonferros Metal," Journal of the Korean Welding and Joining Society, Vol. 14, No. 6, pp. 1-7, 1996.
  9. Back, S. Y., Jang, S. M., "One-wave Step Horn Design for Ultrasonic Machining for Metal Welding", Journal of the Korea Academia-Industrial cooperation Society, Vol. 11, No. 12, pp.4735-4741, February 2010. https://doi.org/10.5762/KAIS.2010.11.12.4735
  10. Park, Y. H. and Kang, J. Y., "Sinter Diffusion Bonding Technology for Assembly and Hybrid of Materials," Journal of the Korean Welding and Joining Society, Vol. 24, No. 5, pp. 7-8, 2006.