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Cu Filling into TSV and non-PR Sn bumping for 3 Dimension Chip Packaging

3차원 칩 패키징을 위한 TSV내 전도금속 충전 및 non-PR 범프 형성

  • Published : 2011.02.28

Abstract

Keywords

References

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Cited by

  1. Various Cu Filling Methods of TSV for Three Dimensional Packaging vol.31, pp.3, 2013, https://doi.org/10.5781/KWJS.2013.31.3.11