Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Deposition of Super Hydrophobic a-C:F Films by Dielectric Barrier Discharge at Atmospheric Pressure

  • Kim, Duk-Jae (Geniatech Inc.) ;
  • Kim, Yoon-Kee (Department of Welding and Production Engineering, Hanbat National University) ;
  • Han, Jeon-Geon (Department of Advanced Materials Science & Engineering, Sungkyunkwan University)
  • Received : 2011.03.22
  • Accepted : 2011.04.29
  • Published : 2011.04.30
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Abstract

Hydrophobic a-C:F film was coated on polycarbonate film with $CF_4$, $C_2F_6$ and HFC ($C_2F_4H_2$) gas in helium discharge generated by 5~100 kHz AC power supply at atmospheric pressure and room temperature. The highest water contact angle of the a-C:F film formed with $He/C_2F_6$ mixed gas is $155^{\circ}$. X-ray photoelectron spectrum showed that there was 40% of C-$CF_3$ bond at the surface of the super hydrophobic film. The contact angle and deposition rate were decreased with increasing substrate temperature. The contact angle was generally increased with the surface roughness of the film. The contact angle was high when the surface microstructure of the film was fine and sharp at the similar roughness and chemical composition of the surface.

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