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The Electrical Properties of GaN Individual Nanorod Devices by Wet-etching of the Nanorod Surface and Annealing Treatment

표면 습식 식각 및 열처리에 따른 GaN 단일 나노로드 소자의 전기적 특성변화

  • Ji, Hyun-Jin (School of Electrical Engineering, Korea University) ;
  • Choi, Jae-Wan (School of Electrical Engineering, Korea University) ;
  • Kim, Gyu-Tae (School of Electrical Engineering, Korea University)
  • 지현진 (고려대학교 전기전자공학부 나노소자연구실) ;
  • 최재완 (고려대학교 전기전자공학부 나노소자연구실) ;
  • 김규태 (고려대학교 전기전자공학부 나노소자연구실)
  • Received : 2010.12.16
  • Accepted : 2011.01.14
  • Published : 2011.02.01

Abstract

Even though nano-scale materials were very advantageous for various applications, there are still problems to be solved such as the stabilization of surface state and realization of low contact resistances between a semiconducting nanowire and electrodes in nano-electronics. It is well known that the effects of contacts barrier between nano-channel and metal electrodes were dominant in carrier transportation in individual nano-electronics. In this report, it was investigated the electrical properties of GaN nanorod devices after chemical etching and rapid thermal annealing for making good contacts. After KOH wet-etching of the contact area the devices showed better electrical performance compared with non-treated GaN individual devices but still didn't have linear voltage-current characteristics. The shape of voltage-current properties of GaN devices were improved remarkably after rapid thermal annealing as showing Ohmic behaviors with further bigger conductivities. Even though chemical etching of the nanorod surfaces could cause scattering of carriers, in here it was shown that the most important and dominant factor in carrier transport of nano-electronics was realization of low contact barrier between nano-channel and metal electrodes surely.

Keywords

References

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