Transactions on Electrical and Electronic Materials

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Transformation Behavior of Ti-(45-x)Ni-5Cu-xCr (at%) (x = 0.5-2.0) Shape Memory Alloys

  • Im, Yeon-Min (School of Materials Science and Engineering, Gyeongsang National University) ;
  • Jeon, Young-Min (School of Materials Science and Engineering, Gyeongsang National University) ;
  • Kim, Min-Su (School of Materials Science and Engineering, Gyeongsang National University) ;
  • Lee, Yong-Hee (School of Materials Science and Engineering, Gyeongsang National University) ;
  • Kim, Min-Kyun (School of Materials Science and Engineering, Gyeongsang National University) ;
  • Nam, Tae-Hyun (School of Materials Science and Engineering, Gyeongsang National University)
  • Received : 2010.12.10
  • Accepted : 2010.12.29
  • Published : 2011.02.28
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Abstract

Transformation behavior and shape memory characteristics of Ti-(45-x)Ni-5Cu-xCr (x=0.5-2.0) alloys have been investigated by means of electrical resistivity measurements, differential scanning calorimetry, X-ray diffraction and thermal cycling tests under constant load. Two-stage B2-B19-B19' transformation occurred in Ti-(45-x)Ni-5Cu-xCr alloys. The B2-B19 transformation was separated clearly from the B19-B19' transformation in Ti-44.0Ni-5Cu-1.0Cr and Ti-43.5Ni-5Cu-1.5Cr alloys. A temperature range where the B19 martensite exists was expanded with increasing Cr content because decreasing rate of Ms (85 K / % Cr) was larger than that of Ms' (17 K / % Cr). Ti-(45-x)Ni-5Cu-xCr alloys were deformed in plastic manner with a fracture strain of 68% ~ 43% depending on Cr content. Substitution of Cr for Ni improves the critical stress for slip deformation in a Ti-45Ni-5Cu alloy due to solid solution hardening.

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References

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