Optimizations of Air-trap Locations in the Speaker Encloser of Mobile Phone by Injection Molding Simulations

사출성형 시뮬레이션에 의한 휴대폰 스피커 인클로저의 에어트랩 위치 최적화

  • Received : 2011.05.31
  • Accepted : 2011.10.06
  • Published : 2011.10.31

Abstract

In this paper a design procedure via computer-aided molding simulation is presented to optimize the air-trap locations in a speaker encloser of mobile phone. The molding flow simulation reveals that the race-tracking phenomenon is the dominant feature in the current mold design. In obtaining an optimal filling pattern, the local modifications of the wall thickness such as in a flow leader attachment are considered as the primary control factor, and both the gate position and the filling time become the secondary control factor. In the one-at-a-time approach, the last location to be filled in the mold cavity could be successfully moved to the extremities of the part, allowing a natural ventilation of entrapped air through the mold parting plane.

Keywords

References

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