대한금속재료학회지 (Korean Journal of Metals and Materials)

  • 제48권8호
  • /
  • Pages.730-740
  • /
  • 2010
  • /
  • 1738-8228(pISSN)
  • /
  • 2288-8241(eISSN)
대한금속재료학회 (The Korean Institute of Metals and Materials)
권호 표지
DOI QR코드

DOI QR Code

표면처리가 어려운 금속재료의 EBSD 분석을 위한 시편 준비

Sample Preparation for EBSD Analysis: Tips for Metals with Delicate Surfaces

  • 강주희 (한국기계연구원 부설 재료연구소) ;
  • 김수현 (한국기계연구원 부설 재료연구소)
  • Kang, Joo-Hee (Grain Structure Control Group, Korea Institute of Materials Science) ;
  • Kim, Su-Hyeon (Grain Structure Control Group, Korea Institute of Materials Science)
  • 투고 : 2010.03.22
  • 발행 : 2010.08.22
⟨ 이전 논문 다음 논문 ⟩

초록

Aluminum, magnesium, titanium and high Mn steel are difficult to use in electron backscatter diffraction (EBSD) sample preparation due to the formation of an oxidation layer under conventional polishing. Alcohol-based polishing with colloidal silica suspension was introduced for these delicate samples. A hard particle-embedded sample was analyzed successfully using mechanical polishing. Ion-milling was effective in removing oxidized, deformed and transformed layers after mechanical polishing and was able to reduce artifacts significantly. The microstructure of a cross-section of a thin copper film was evaluated by attachment of a dummy to the film for mechanical polishing.

키워드

과제정보

연구 과제 주관 기관 : 재료연구소

참고문헌

  1. S. Piazolo, V. G. Sursaeva, and D. J. Prior, Mater. Sci. Forum 495-497, 213 (2005).
  2. V. Randle and O. Engler, Introduction to texture analysis: Macrotexture, microtexture and orientation mapping, pp.125-203. CRC Press, New York (2000).
  3. R. A. Schwarzer, D. P. Field, B. L. Adams, M. Kumar, and A. J. Schwartz, Electron backscatter diffraction in materials science, 2nd ed., (eds. A. J. Schwartz, M. Kumar, B. L. Adams, D. P. Field), pp.1-20, Springer, New York (2009).
  4. F. J. Humphreys, Proc. ICOTOM 12 (ed. J. Szpunar), pp. 74-79, NRC Research Press, Ottawa (1999).
  5. F. J. Humphreys, J. Mater. Sci. 36, 3833 (2001). https://doi.org/10.1023/A:1017973432592
  6. N. -J. Park, D. P. Field, M. M. Nowell, and P. R. Besser, J. Electronic Mater. 34, 1500 (2005). https://doi.org/10.1007/s11664-005-0157-7
  7. G. G. E. Seward, D. J. Prior, J. Wheeler, S. Celotto, D. J. Halliday, R. S. Paden, and M. R. Tye, Scanning 24, 232 (2002).
  8. I. Lischewski, D. M. Kirch, Z. Ziemons, and G. Gottstein, Ceramic Transactions 201, 95 (2008).
  9. M. Ojima, Y. Adachi, Y. Tomota, K. Ikeda, T. Kamiyama, and Y. Katada, Mater. Sci. Eng. A 527, 16 (2009). https://doi.org/10.1016/j.msea.2009.07.066
  10. S. Zaefferer, P. Romano, and F. Friedel, J . Microscopy 230, 499 (2008). https://doi.org/10.1111/j.1365-2818.2008.02010.x
  11. M. M. Nowell, S. I. Wright, and J. O. Carpenter, Ceramic Transactions 200, 285 (2008).
  12. S. -H. Kim, J. -H. Kang, and S. Z. Han, Mater. Trans. 51, 659 (2010). https://doi.org/10.2320/matertrans.MG200910
  13. EDAX-TSL, OIM Analysis 5.3 manual (2008).
  14. S. Suzuki, EBSD textbook: OIM analyis (B2.02), TSL solutions, Tokyo (2007).
  15. K. Nogita and A. K. Dahle, Mater. Char. 46, 305 (2001). https://doi.org/10.1016/S1044-5803(00)00109-1
  16. M. V. Kral, Mater. Let. 59, 2271 (2005). https://doi.org/10.1016/j.matlet.2004.05.091
  17. M. V. Kral, H. R. McIntyre, and M. J. Smillie, Scripta Mater. 51, 215 (2004). https://doi.org/10.1016/j.scriptamat.2004.04.015
  18. A. A. Zaldivar-Cadena and A. Flores-Valdes, Mater. Char. 58, 834 (2007). https://doi.org/10.1016/j.matchar.2006.12.006
  19. J. S. Kyeong, D. H. Kim, and W. T. Kim, Proc. 2009 Fall Conference of the Korean Institute of Metals and Materials, p.22, Korean Inst. Metals & Mater., Daegu, Korea (2009).
  20. G. Coccia Lecis, C. Lenardi, A. Sabatini, Metall. Mater. Trans. A 28, 1219 (1997). https://doi.org/10.1007/s11661-997-0287-z
  21. J. E. Jin, Y. S. Jung, and Y. K. Lee, Mater. Sci. Eng. A 449-451, 786 (2006).
  22. Y. K. Lee, J. E. Jin, and Y. Q. Ma, Scripta Mater. 57, 707 (2007). https://doi.org/10.1016/j.scriptamat.2007.06.047
  23. J. -H. Cho, J. -S. Cho, J. -T. Moon, J. Lee, Y. H. Cho, Y. W. Kim, A. D. Rollett, and K. H. Oh, Metall. Mater. Trans. A 34, 1113 (2003). https://doi.org/10.1007/s11661-003-0131-z
  24. M. M. Nowell, J. Elec. Mater. 31, 23 (2002). https://doi.org/10.1007/s11664-002-0168-6
  25. T. Muppidi, D. P. Field, J. E. Sanchez Jr., and C. Woo, Thin Solid Films 471, 63 (2005). https://doi.org/10.1016/j.tsf.2004.04.057
  26. Y. M. Park, D. -S. Ko, K. -W. Yi, I. Petrov, and Y. -W. Kim, Ultramicroscopy 107, 663 (2007). https://doi.org/10.1016/j.ultramic.2007.01.002
  27. S. H. Lee and N.-J. Par, J. Kor. Inst. Met. & Mater. 45, 377 (2007).
  28. C. Lingk, M. E. Gross, and W. L. Brown, J. App. Phy. 87, 2232 (2000). https://doi.org/10.1063/1.372166