Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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The Effect of Bubble Generated during COG Bonding on the Joint Reliability

COG본딩 공정 중 형성된 기포가 접합 신뢰도에 미치는 영향

  • Choi, Eun-Soo (Department of Mechanical system Engineering, Korea Polytechnic Univ.) ;
  • Yun, Won-Soo (Department of Mechanical Engineering, Korea Polytechnic Univ.) ;
  • Jeong, Young-Hun (Department of Mechanical Engineering, Korea Polytechnic Univ.) ;
  • Kim, Bo-Sun (LG Display Co., Ltd) ;
  • Jin, Song-Wan (Department of Mechanical Engineering, Korea Polytechnic Univ.)
  • 최은수 (한국산업기술대학교 대학원 기계시스템공학과) ;
  • 윤원수 (한국산업기술대학교 기계공학과) ;
  • 정영훈 (한국산업기술대학교 기계공학과) ;
  • 김보선 (LG 디스플레이(주)) ;
  • 진송완 (한국산업기술대학교 기계공학과)
  • Received : 2010.05.02
  • Accepted : 2010.06.01
  • Published : 2010.07.01
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Abstract

The effect of COG bonding parameters, especially the bonding temperature, on the bonding quality and reliability was investigated in this paper. We measured the bubble area formed in the ACF resin during the bonding process and tried to investigate the relationship between bubble area and bonding peel strength. 85/85 test which exposes a sample to a 85% humidity and $85^{\circ}C$ temperature condition was also carried out. The bubble area was dramatically increased under ~$10^{\circ}C$ lower than recommended bonding temperature. The bubble area formed at the edge of IC chip was larger than the other parts of IC chip. But the peel strength was not associated with the bubble area. High temperature and humid condition made the bubble area larger, but we could not find clear trend of change in the peel strength.

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References

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