Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Chip on Glass Interconnection using Lateral Thermosonic Bonding Technology

횡방향 열초음파 본딩 기법을 이용한 COG 접합

  • Received : 2010.05.03
  • Accepted : 2010.06.01
  • Published : 2010.07.01
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Abstract

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

Keywords

References

  1. Lau, J. H., "Low-cost Flip Chip Technologies," McGraw-Hill Press, pp. 1-95, 2000.
  2. Garrou, P., "Wafer Level Chip Scale Packaging (WLCSP): An overview," IEEE Transaction on Advanced Packaging, Vol. 23, No. 2, pp. 198-205, 2000. https://doi.org/10.1109/6040.846634
  3. Kim, J. W., Lee, Y. C., Kim, D. G. and Jung, S. B., "Reliability of Adhesive Interconnections for Application in Display Module," Microelectronic Engineering, Vol. 84, No. 11, pp. 2691-2696, 2007. https://doi.org/10.1016/j.mee.2007.05.066
  4. Sato, K., Lee, K., Nishimura, M. and Okutsu, K., "Self-alignment and Bonding of Microparts using Adhesive Droplets," International Journal of Precision Engineering and Manufacturing, Vol. 8, No. 2, pp. 75-79, 2007.
  5. Riley, G. A., "A Buyer's Guide to Flip Chip," http://flipchips.com.
  6. Tan, Q., Zhang, W., Schaible, B., Bond, L. J., Ju, T. H. and Lee, Y. C., "Thermosonic Flip-chip Bonding using Longitudinal Vibration," Proceeding of 47th Electronic Components and Technology Conference, pp. 1128-1133, 2007.
  7. Lee, K. W., Kim, H. J., Yim, M. J. and Paik, K. W., "Curing and Bonding Behaviors of Anisotropic Conductive Films (ACFs) by Ultrasonic Vibration for Flip Chip Interconnection," Proceeding of Electronic Components and Technology Conference, pp. 918-923, 2006
  8. Sony Chemical, "CP8830IH4 Technical Data," 2001.
  9. Jang, T. Y., Ha, C. W. and Kim, K. S., "Lateral Thermosonic Flip-chip Bonding with Anisotropic Conductive Film (ACF)," Proceeding of IEEE International Symposium on Assembly and Manufacturing, pp. 113-117, 2009.
  10. Joung, S. W., Yun, W. S. and Kim, K. S., "Ultrasonic ACF Bonding Technique for Mounting LCD Driver ICs," Journal of Institute of Control, Robotics and System, Vol. 14, No. 6, pp. 543-547, 2008. https://doi.org/10.5302/J.ICROS.2008.14.6.543
  11. Ha, C. W., "A Study on Lateral Thermosonic Bonding Technology," Mechanical Engineering, Mater Thesis, KAIST, 2010.
  12. Jang, T. Y., Yun, W. S., Kim, S. H. and Kim, K. S., "Using Ultrasonic Energy for Reducing ACF Bonding Process Time," Proceeding of 33rd International Electronics Manufacturing Technology Conference, pp. 171-176, 2008.
  13. Sony Chemical & Information Device Corporation, www.sonycid.jp