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Pattern Partitioning and Decision Method in the Semiconductor Chip Marking Inspection

반도체 부품 마크 미세 결함 검사를 위한 패턴 영역 분할 및 인식 방법

  • 장유정 (호서대학교 디지털디스플레이공학과) ;
  • 이정섭 (호서대학교 디지털디스플레이공학과) ;
  • 주효남 (호서대학교 디지털디스플레이공학과) ;
  • 김준식 (호서대학교 전자공학과)
  • Received : 2010.01.28
  • Accepted : 2010.07.04
  • Published : 2010.09.01

Abstract

To inspect the defects of printed markings on the surface of IC package, the OCV (Optical Character Verification) method based on NCC (Normalized Correlation Coefficient) pattern matching is widely used. In order to detect the micro pattern defects appearing on the small portion of the markings, a Partitioned NCC pattern matching method was proposed to overcome the limitation of the NCC pattern matching. In this method, the reference pattern is first partitioned into several blocks and the NCC values are computed and are combined in these small partitioned blocks, rather than just using the NCC value for the whole reference pattern. In this paper, we proposed a method to decide the proper number of partition blocks and a method to inspect and combine the NCC values of each partitioned block to identify the defective markings.

Keywords

References

  1. H.-D. Lin, “Automated visual inspection of ripple defects using wavelet characteristic based multivariate statistical approach,” Image and Vision Computing, vol. 25, pp. 1785-1801, 2007. https://doi.org/10.1016/j.imavis.2007.02.002
  2. H.-D. Lin, “Computer-aided visual inspection of surface defects in ceramic capacitor chips,” Journal of Materials Processing Technology, vol. 189, pp. 19-25, 2007. https://doi.org/10.1016/j.jmatprotec.2006.12.051
  3. D.-M. Tsai and S.-C. Lai, “Defect detection in periodically patterned surfaces using independent component analysis,” Pattern Recognition, vol. 41, pp. 2812-2832, 2008. https://doi.org/10.1016/j.patcog.2008.02.011
  4. H. Elbehiery, A. Hefnawy, and M. Elewa, “Surface defects detection for ceramic tiles using image processing and morphological techniques,” World Academy of Science, Engineering and Technology, 2005.
  5. R. Brunelli and S. Messelodi, “Robust estimation of correlation with applications to computer vision,” Pattern Recognition, vol. 28, no. 6, pp. 833-841, 1995. https://doi.org/10.1016/0031-3203(94)00170-Q
  6. C.-C. Han and K.-C. Fan, “3.Mesh Pattern Recognition Using Correlation Matching Method,” MVA'94 IAPR Workshop on Machine Vision Applications, Dec. 13-15, 1994.
  7. D.-M. Tsai, C.-T. Lin, and J.-F. Chen, “The evaluation of normalized cross correlations for defect detection,” Pattern Recognition Letters, vol. 24, pp. 2525-2535, 2003. https://doi.org/10.1016/S0167-8655(03)00098-9
  8. S.-H. Chen and T.-T. Liao, “An automated IC chip marking inspection system for surface mounted devices on taping machines,” Journal of Scientific & Industrial Research, vol. 68, pp. 361-366, 2009
  9. D.-M. Tsai and C.-T. Lin, “Fast normalized cross correlation for defect detection,” Pattern Recognition Letters, vol. 24, pp. 2625-2631, 2003. https://doi.org/10.1016/S0167-8655(03)00106-5
  10. 이정섭, 주효남, 류근호, 김광섭, “OCV 기반 반도체 패키지 외관검사 시스템에서 상관계수를 이용한 마크의 분할 검사방법,” 영상처리 및 이해에 관한 워크샵, 제20회, p. 125, 2008.
  11. R C. Gonzalez, R E. Woods, Digital Image Processing, Prentice-Hall, USA, 2002.
  12. 이정섭, “패턴인식을 이용한 반도체 패키지 몰드면 결함의 자동 분류 알고리즘,” 석사 졸업 논문, 2009.
  13. J. Kittler and J. Illingworth, “Minimum error thresholding,” Pattern Recognition, vol. 19, no. 1, pp. 41-47, 1986. https://doi.org/10.1016/0031-3203(86)90030-0
  14. 한학용, 패턴인식 개론-MATLAB 실습을 통한 입체적학습, 한빛미디어, 서울, 한국, 2008.

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